PIC16F785-I/SO Microchip Technology, PIC16F785-I/SO Datasheet - Page 149

• Manufacturer Part Number: PIC16F785-I/SO
• Description: IC PIC MCU FLASH 2KX14 20SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F785-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 20-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 14-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT20SO1-1 - SOCKET TRANS ICE 20DIP TO 20SOICXLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC162060 - HEADER INTRFC MPLAB ICD2 20PINAC164039 - MODULE SKT PROMATE II 20DIP/SOIC
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

19.3
© 2008 Microchip Technology Inc.
DC CHARACTERISTICS
D020E
D021E
D022E
D023E
D023E
D024E
D024E
D025E
D026E
D027E
D028E
Note 1:
Param
No.
2:
3:
4:
†
DC Characteristics: PIC16F785/HV785-E (Extended)
Power-down Base Current
(I
PD
Device Characteristics
Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
The test conditions for all I
rail; all I/O pins tri-stated, pulled to V
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature also have an impact on the current
consumption.
The peripheral current is the sum of the base I
enabled. The peripheral Δ current can be determined by subtracting the base I
values should be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
consume any current other than leakage current. The power-down current spec includes any such leakage from the
A/D module.
)
(4)
DD
measurements in Active Operation mode are: OSC1 = external square wave, from rail to
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
DD
; MCLR = V
Typ†
0.15
0.20
0.35
0.30
0.36
362
418
500
112
132
202
217
1.7
2.5
3.2
4.8
42
85
96
39
59
98
30
45
75
10
11
2
3
9
DD
Max
17.5
or I
127
476
554
625
130
147
168
124
417
468
15
19
22
65
47
72
36
55
95
21
28
45
12
16
20
26
30
11
DD
9
PD
; WDT disabled.
and the additional current consumed when this peripheral is
Units
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
uA
uA
μA
μA
μA
μA
μA
-40°C ≤ T
PIC16F785/HV785
V
2.0
3.0
5.0
2.0
3.0
5.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
2.0
3.0
5.0
3.0
5.0
3.0
3.0
5.0
3.0
5.0
DD
A
(1), (2)
≤ +125°C for extended
WDT, BOR, Comparators, V
Op Amps and VR disabled
WDT Current
BOR Current
Comparator Current
CxSP = 1
Comparator Current
CxSP = 0
CV
Low Range
CV
High Range
T1 O
A/D Current
(not converting)
VR Current
Op Amp Current
DD
REF
REF
(Continued)
or I
SC
DD
Current
Current
PD
Current
Conditions
. When A/D is off, it will not
current from this limit. Max
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
DS41249E-page 147
REF
, T1OSC,