PIC18F2420-I/SP Microchip Technology, PIC18F2420-I/SP Datasheet - Page 368

• Manufacturer Part Number: PIC18F2420-I/SP
• Description: IC MCU FLASH 8KX16 28-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2420-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SPI, I2C, USART
• Maximum Clock Frequency: 31 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Data Rom Size: 256 KB
• Height: 3.3 mm
• Length: 34.67 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.2 V
• Width: 7.24 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F2420/2520/4420/4520
28-Lead Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC)
DS39631A-page 366
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
E1
E
Dimension Limits
h
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
2
1
D
L
MIN
Preliminary
.093
.088
.004
.394
.288
.695
.010
.016
.009
.014
0
0
0
A1
INCHES*
A
NOM
.050
.099
.008
.407
.295
.704
.020
.033
.017
.091
.011
28
12
12
4
MAX
.104
.094
.012
.420
.299
.712
.029
.050
.013
.020
15
15
8
MIN
17.65
10.01
2.36
2.24
0.10
7.32
0.25
0.23
0.36
0.41
0
0
0
MILLIMETERS
 2004 Microchip Technology Inc.
NOM
10.34
17.87
1.27
2.50
0.20
7.49
0.50
0.84
0.28
0.42
2.31
28
12
12
4
MAX
A2
10.67
18.08
2.64
2.39
0.30
7.59
0.74
1.27
0.33
0.51
15
15
8