PIC18LF2455-I/SP Microchip Technology, PIC18LF2455-I/SP Datasheet - Page 8
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PIC18LF2455-I/SP
Manufacturer Part Number
PIC18LF2455-I/SP
Description
IC PIC MCU FLASH 12KX16 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XR1.pdf
(438 pages)
3.PIC18F2221-ISO.pdf
(46 pages)
4.PIC18F2455-ISO.pdf
(14 pages)
5.PIC18F2455-ISO.pdf
(8 pages)
6.PIC18F2455-ISO.pdf
(26 pages)
7.PIC18LF4550-IML.pdf
(430 pages)
Specifications of PIC18LF2455-I/SP
Core Size
8-Bit
Program Memory Size
24KB (12K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
24
Eeprom Memory Size
256Byte
Ram Memory Size
2048Byte
Cpu Speed
48MHz
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2048 B
Interface Type
SPI, I2C, EAUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
24
Number Of Timers
1 x 8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163014, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
PIC18F2455/2550/4455/4550
8. Module: A/D
TABLE 28-8:
9. Module: DC Characteristics (BOR)
DS80478A-page 8
A06A
A06
Param
No.
The A/D offset is greater than the specified limit in
Table 28-8 of the Device Data Sheet. The updated
conditions and limits are shown in bold text in
Table 28-8.
Work around
Any of three work arounds may be used.
Affected Silicon Revisions
When the trip point for BORV<1:0> = 11, the val-
ues for parameter D005 (V
“DC Characteristics” of the Device Data Sheet
are not applicable as the device may reset below
the minimum operating voltage for the device.
Work around
None.
Affected Silicon Revisions
A3
A3
X
X
Symbol
E
E
OFF
OFF
B4
B4
A/D CONVERTER CHARACTERISTICS:PIC18F2455/2550/4455/4550 (INDUSTRIAL)
PIC18LF2455/2550/4455/4550 (INDUSTRIAL)
Offset Error
Offset Error
Characteristic
B5
B5
BOR
) in Section 28.1
B6
B6
B7
B7
Min
—
—
10. Module: USB
Typ
—
—
• Configure the A/D to use the V
• Perform a conversion on a known voltage
• Increase system clock speed to 48 MHz and
When an IN endpoint is owned by USB SIE and
the UCON register’s PKTDIS bit is set, if a USB
NAK event occurs on the IN endpoint before the
PKTDIS bit is clear, then after the PKTDIS is clear,
the pending IN endpoint will send out more bytes
than expected. For example, if configured to send
out 8 bytes, the SIE would actually send out
12 bytes of data.
Work around
The PKTDIS bit is set when a USB control transfer
setup packet is received. Clear this bit as soon as
possible, particularly before turning over any IN
endpoint ownership to the SIE.
Affected Silicon Revisions
pins for the voltage references. This is done
by setting the VCFG<1:0> bits
(ADCON1<5:4>).
reference voltage and adjust the A/D result in
software.
adjust A/D settings accordingly. Higher
system clock frequencies decrease offset
error.
A3
X
<±2.0
<±3.5
Max
B4
Units
LSb
LSb
© 2009 Microchip Technology Inc.
B5
V
V
REF
REF
= V
= V
Conditions
REF
B6
REF
SS
+ and V
and V
+ and V
REF
DD
B7
REF
-
-