DSPIC33FJ128MC706-I/PT Microchip Technology, DSPIC33FJ128MC706-I/PT Datasheet - Page 355

IC DSPIC MCU/DSP 128K 64TQFP

DSPIC33FJ128MC706-I/PT

Manufacturer Part Number
DSPIC33FJ128MC706-I/PT
Description
IC DSPIC MCU/DSP 128K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ128MC706-I/PT

Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
53
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
16 KB
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Data Rom Size
4096 B
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA330013 - MODULE PLUG-IN DSPIC33 100TQFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ128MC706-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ128MC706-I/PT
Manufacturer:
ST
0
Company:
Part Number:
DSPIC33FJ128MC706-I/PT
Quantity:
36
dsPIC33F
27.2
The following sections give the technical details of the
packages.
64-Lead Plastic Thin-Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70165D-page 352
Package Details
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
A
L
F
E
D
c
B
L
n
MIN
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
2
1
Preliminary
0
5
5
D1
.039 REF.
INCHES
CH x 45°
NOM
D
.024
.394
.394
.020
.043
.039
.006
.472
.472
.007
.009
.035
3.5
64
16
10
10
A1
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
F
15
15
7
MIN
11.75
11.75
0.64
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0
5
5
MILLIMETERS*
1.00 REF.
© 2006 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
0.18
0.22
0.89
Revised 07-22-05
3.5
64
16
10
10
MAX
A2
12.25
12.25
10.10
10.10
1.14
1.20
1.05
0.25
0.75
0.23
0.27
15
15
7

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