PIC24HJ256GP610-I/PT Microchip Technology, PIC24HJ256GP610-I/PT Datasheet - Page 278

• Manufacturer Part Number: PIC24HJ256GP610-I/PT
• Description: IC PIC MCU FLASH 128KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ256GP610-I/PT

• Core Size: 16-Bit
• Program Memory Size: 256KB (85.5K x 24)
• Core Processor: PIC
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b, 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFQFP
• Controller Family/series: PIC24
• No. Of I/o's: 85
• Ram Memory Size: 16KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• No. Of Pwm Channels: 8
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (12 bit, 32 Channel)
• A/d Bit Size: 12 bit
• A/d Channels Available: 32
• Height: 1 mm
• Length: 12 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 12 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDAC164333 - MODULE SKT FOR PM3 100QFPDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24H
100-Lead Plastic Thin-Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70175C-page 276
c
B
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-110
p
See ASME Y14.5M
See ASME Y14.5M
Dimension Limits
#leads=n1
E1
E
Units
n1
A2
E1
D1
A1
n
p
L
F
E
D
B
A
c
n
MIN
.037
.002
.018
.004
.007
Preliminary
11°
11°
2
1
0°
D1
.020 BSC
.630 BSC
.630 BSC
.551 BSC
.551 BSC
.039 REF
L
INCHES
D
NOM
A1
.039
.024
.009
100
3.5°
12°
12°
25
A
MAX
.047
.006
.030
.008
.041
.011
13°
13°
F
7°
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
MILLIMETERS*
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
© 2006 Microchip Technology Inc.
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
Revised 07-21-05
100
3.5°
12°
12°
25
MAX
1.20
1.05
0.15
0.75
0.20
0.27
A2
13°
13°
7°