LPC1113FHN33/301,5 NXP Semiconductors, LPC1113FHN33/301,5 Datasheet - Page 60

• Manufacturer Part Number: LPC1113FHN33/301,5
• Description: IC MCU 32BIT 24KB FLASH 33HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC1100r

Specifications of LPC1113FHN33/301,5

• Program Memory Type: FLASH
• Program Memory Size: 24KB (24K x 8)
• Package / Case: 33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 28
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC11
• Core: ARM Cortex M0
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART
• Number Of Programmable I/os: 28
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1100
• Device Core: ARM Cortex M0
• Device Core Size: 32b
• Frequency (max): 50MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 33
• Package Type: HVQFN EP
• Package: 33HVQFN EP
• Family Name: LPC1100
• Maximum Speed: 50 MHz
• Number Of Timers: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4951; 935290776551

NXP Semiconductors
Fig 35. Package outline PLCC44
LPC1111_12_13_14
Product data sheet
PLCC44: plastic leaded chip carrier; 44 leads
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
β
VERSION
SOT187-2
OUTLINE
0.180
0.165
4.57
4.19
k
40
44
A
1
6
min.
0.51
0.02
A 1
y
39
7
pin 1 index
0.25
0.01
A 3
max.
3.05
0.12
e
A 4
112E10
IEC
0.021
0.013
0.53
0.33
b p
H
e
D
D
D
0.032
0.026
0.81
0.66
b 1
16.66
16.51
0.656
0.650
D
(1)
All information provided in this document is subject to legal disclaimers.
MS-018
JEDEC
X
16.66
16.51
0.656
0.650
E
(1)
29
REFERENCES
17
Rev. 4 — 10 February 2011
0
Z D
1.27
0.05
e
28
18
16.00
14.99
0.63
0.59
B
e D
EDR-7319
Z E
v
e
JEITA
scale
v
16.00
14.99
M
0.63
0.59
5
e E
M
E
A
A
B
17.65
17.40
0.695
0.685
H
H D
E
17.65
17.40
0.695
0.685
H E
10 mm
0.048
0.042
1.22
1.07
k
32-bit ARM Cortex-M0 microcontroller
A
0.057
0.040
1.44
1.02
L p
LPC1111/12/13/14
A
4
0.007
0.18
A
v
1
PROJECTION
w
EUROPEAN
0.007 0.004
0.18
detail X
w
M
e
E
b
0.1
p
L
y
p
0.085
Z D
max.
2.16
(1)
© NXP B.V. 2011. All rights reserved.
b
(A )
Z E
max.
0.085
ISSUE DATE
2.16
1
3
99-12-27
01-11-14
(1)
SOT187-2
45
β
o
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