DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 764
DF2505BR26DV
Manufacturer Part Number
DF2505BR26DV
Description
IC H8S/2505 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Specifications of DF2505BR26DV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2505BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 20 Flash Memory
read is undetermined. Perform MAT switching in accordance with the description in section 20.7,
Switching between User MAT and User Boot MAT.
Except for MAT switching, the programming procedure is the same as that in user program mode.
The area that can be executed in the steps of the user procedure program (on-chip RAM and user
MAT) is shown in section 20.4.4, Procedure Program and Storable Area for Programming Data.
(3)
User MAT Erasing in User Boot Mode
For erasing the user MAT in user boot mode, additional processing made by setting FMATS are
required: switching from user-boot-MAT selection state to user-MAT selection state, and
switching back to user-boot-MAT selection state after erasing completes.
Figure 20.15 shows the procedure for erasing the user MAT in user boot mode.
Rev. 6.00 Sep. 24, 2009 Page 716 of 928
REJ09B0099-0600
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