PIC12F635-E/P Microchip Technology, PIC12F635-E/P Datasheet - Page 215
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F635-E/P
Manufacturer Part Number
PIC12F635-E/P
Description
IC MCU FLASH 1KX14 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Specifications of PIC12F635-E/P
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
5
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Eeprom Memory Size
128Byte
Ram Memory Size
64Byte
Cpu Speed
20MHz
No. Of Timers
2
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232, SPI, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029, DV164101, DM163014
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0201 - MPLABICE 8P 300 MIL ADAPTER
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
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- Download datasheet (4Mb)
17.2
The following sections give the technical details of the packages.
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
Package Details
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
PIC12F635/PIC16F636/639
e
Units
L
A2
A1
E1
b1
eB
E1
N
A
E
D
e
L
c
b
A2
.015
.290
.240
.348
.115
.008
.040
.014
MIN
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–
DS41232D-page 213
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