PIC12HV615-I/P Microchip Technology, PIC12HV615-I/P Datasheet - Page 155
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PIC12HV615-I/P
Manufacturer Part Number
PIC12HV615-I/P
Description
IC PIC MCU FLASH 1KX14 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(8 pages)
3.PIC12F609T-ISN.pdf
(26 pages)
4.PIC16F616T-ISL.pdf
(4 pages)
5.PIC16F616T-ISL.pdf
(8 pages)
6.PIC12F615-ESN.pdf
(168 pages)
Specifications of PIC12HV615-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
5
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12H
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC162059 - HEADER INTRFC MPLAB ICD2 8/14PINAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12HV615-I/P
Manufacturer:
MIC
Quantity:
3 580
Part Number:
PIC12HV615-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
© 2006 Microchip Technology Inc.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
45
Dimension Limits
§
E1
E
Units
A2
A1
E1
A
E
D
B
n
p
h
L
c
PIC12F609/615/12HV609/615
MIN
Preliminary
h
.053
.052
.004
.228
.146
.189
.010
.019
.008
.013
2
1
0
0
0
L
D
INCHES*
NOM
8
.050
.056
.007
.237
.154
.193
.015
.025
.009
.017
.061
12
12
4
A
A1
MAX
.069
.010
.244
.157
.197
.020
.030
.010
.020
.061
15
15
8
MIN
1.35
1.32
0.10
5.79
4.80
0.25
0.48
0.20
0.33
3.71
0
0
0
MILLIMETERS
NOM
8
1.27
1.55
1.42
0.18
6.02
4.90
0.38
0.62
0.23
0.42
3.91
12
12
4
DS41302A-page 153
MAX
A2
1.75
1.55
0.25
6.20
3.99
5.00
0.76
0.25
0.51
0.51
15
15
8