PIC16F688-E/ML Microchip Technology, PIC16F688-E/ML Datasheet - Page 576

• Manufacturer Part Number: PIC16F688-E/ML
• Description: IC PIC MCU FLASH 4KX14 16QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F688-E/ML

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 12
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 16-QFN
• Controller Family/series: PIC16F
• No. Of I/o's: 12
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 256Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: EUSART, RS- 232, SCI, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNXLT16QFN1 - SOCKET TRANSITION 14DIP TO 16QFNAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC162056 - HEADER INTERFACE ICD2 16F688
• Lead Free Status / Rohs Status: Details

PICmicro MID-RANGE MCU FAMILY
30.5
DS31030A-page 30-6
Device Current Specifications
I
taken with all I/O as inputs, either pulled high or low. That is, there are no floating inputs, nor are
any pins driving an output (with a load).
I
referred to as power-down current. These tests are taken with all I/O as inputs, either pulled high
or low. That is, there are no floating inputs, nor are any pins driving an output (with a load), weak
pull-ups are disabled.
A device may have certain features and modules that can operate while the device is in sleep
mode. Some on these modules are:
• Watchdog Timer (WDT)
• Brown-out Reset (BOR) circuitry
• Timer1
• Analog to Digital converter
• LCD module
• Comparators
• Voltage Reference
When all features are disabled, the device will consume the lowest possible current (the leakage
current). If any of these features are operating while the device is in sleep, a higher current will
occur. The difference between the lowest power mode (everything off) at only that one feature
enabled (such as the WDT) is what we call the Module Differential Current. If more then one
feature is enabled then the expected current can easily be calculated as: the base current (every-
thing disabled and in sleep mode) plus all Module Differential Currents (delta currents).
Example 30-1
WDT and Timer1 oscillator enabled.
Example 30-1:
DD
PD
Base Current
WDT Delta Current
Timer1 Delta Current
Total Sleep Current
is the current (I) that the device consumes when the device is in operating mode. This test is
is the current (I) that the device consumes when the device is in sleep mode (power-down),
shows an example of calculating the typical currents for a device at 5V, with the
I
PD
Calculations with WDT and Timer1 Oscillator Enabled (@ 5V)
14 nA
14 A
22 A
36 A
; Device leakage current
; 14 A - 14 nA = 14 A
; 22 A - 14 nA = 22 A
;
1997 Microchip Technology Inc.