PIC16F1823-I/P Microchip Technology, PIC16F1823-I/P Datasheet - Page 49

• Manufacturer Part Number: PIC16F1823-I/P
• Description: IC MCU 8BIT FLASH 14-DIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F1823-I/P

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 KB
• Interface Type: MI2C, SPI, EUSART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• On-chip Dac: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

4.0
Device Configuration consists of Configuration Word 1
and Configuration Word 2, Code Protection and Device
ID.
4.1
There are several Configuration Word bits that allow
different oscillator and memory protection options.
These are implemented as Configuration Word 1 at
8007h and Configuration Word 2 register at 8008h.
 2010 Microchip Technology Inc.
Note:
DEVICE CONFIGURATION
Configuration Words
The DEBUG bit in Configuration Word 2 is
managed
development tools including debuggers
and programmers. For normal device
operation, this bit should be maintained as
a '1'.
automatically
PIC12F/LF1822/PIC16F/LF1823
by
device
Preliminary
DS41413B-page 49