PIC12CE518-04/P Microchip Technology, PIC12CE518-04/P Datasheet - Page 102

• Manufacturer Part Number: PIC12CE518-04/P
• Description: IC MCU OTP 512X12 W/EE 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12CE518-04/P

• Core Size: 8-Bit
• Program Memory Size: 768B (512 x 12)
• Core Processor: PIC
• Speed: 4MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Type: OTP
• Eeprom Size: 16 x 8
• Ram Size: 25 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Eeprom Memory Size: 16Byte
• Ram Memory Size: 25Byte
• Cpu Speed: 4MHz
• No. Of Timers: 1
• Processor Series: PIC12C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 25 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 1
• Operating Supply Voltage: 3 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• On-chip Adc: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC12C5XX
Package Type:
DS40139E-page 102
Units
Dimension Limits
Pitch
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Shoulder Radius
Gull Wing Radius
Foot Length
Foot Angle
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
p
c
†
‡
*
n
Controlling Parameter.
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
K04-056 8-Lead Plastic Small Outline (SM) – Medium, 208 mil
E1
p
n
A
A1
A2
D
E
E1
R1
R2
L
L1
c
B
E
‡
†
‡
R1
MIN
0.070
0.037
0.002
0.200
0.203
0.300
0.005
0.005
0.011
0.010
0.008
0.014
0
0
0
2
1
L1
INCHES*
L
NOM
D
0.050
0.074
0.042
0.005
0.205
0.208
0.313
0.005
0.005
0.016
0.015
0.009
0.017
R2
12
12
8
4
A2
A
MAX
0.079
0.048
0.009
0.210
0.213
0.325
0.010
0.010
0.021
0.020
0.010
0.020
15
15
8
MIN
1.78
0.94
0.05
5.08
5.16
7.62
0.13
0.13
0.28
0.25
0.19
0.36
MILLIMETERS
0
0
0
1999 Microchip Technology Inc.
NOM
1.27
1.89
1.08
0.14
5.21
5.28
7.94
0.13
0.13
0.41
0.38
0.22
0.43
12
12
8
4
MAX
A1
2.00
1.21
0.22
5.33
5.41
8.26
0.25
0.25
0.53
0.51
0.25
0.51
15
15
8