PIC16C712-04/SS Microchip Technology, PIC16C712-04/SS Datasheet - Page 96

• Manufacturer Part Number: PIC16C712-04/SS
• Description: IC MCU OTP 1KX14 A/D PWM 20SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C712-04/SS

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 4MHz
• Number Of I /o: 13
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-SSOP
• Controller Family/series: PIC16C
• No. Of I/o's: 13
• Ram Memory Size: 128Byte
• Cpu Speed: 4MHz
• No. Of Timers: 3
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 3 bit
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• On-chip Adc: 4 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 309-1016 - ADAPTER 20-SSOP TO 18-DIP
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16C712/716
Package Type:
DS41106A-page 96
JEDEC equivalent: MS-013 AB
Units
Dimension Limits
Pitch
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Chamfer Distance
Shoulder Radius
Gull Wing Radius
Foot Length
Foot Angle
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
†
‡
*
p
n
Controlling Parameter.
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
K04-051 18-Lead Plastic Small Outline (SO) – Wide, 300 mil
45 °
E1
E
X
R1
p
n
A
A1
A2
D
E
E1
X
R1
R2
L
L1
c
B
‡
†
‡
2
1
MIN
L1
0.093
0.048
0.004
0.450
0.292
0.394
0.010
0.005
0.005
0.011
0.010
0.009
0.014
Preliminary
L
D
0
0
0
INCHES*
R2
NOM
0.050
0.099
0.058
0.008
0.456
0.296
0.407
0.020
0.005
0.005
0.016
0.015
0.011
0.017
18
12
12
A
4
A2
MAX
0.104
0.068
0.011
0.462
0.299
0.419
0.029
0.010
0.010
0.021
0.020
0.012
0.019
15
15
8
MIN
11.43
10.01
2.36
1.22
0.10
7.42
0.25
0.13
0.13
0.28
0.25
0.23
0.36
MILLIMETERS
0
0
0
1999 Microchip Technology Inc.
NOM
11.58
10.33
1.27
2.50
1.47
0.19
7.51
0.50
0.13
0.13
0.41
0.38
0.27
0.42
18
12
12
4
MAX
11.73
10.64
2.64
1.73
0.28
7.59
0.74
0.25
0.25
0.53
0.51
0.30
0.48
A1
15
15
8