PIC18F14K22-E/P Microchip Technology, PIC18F14K22-E/P Datasheet - Page 331
PIC18F14K22-E/P
Manufacturer Part Number
PIC18F14K22-E/P
Description
IC MCU 8BIT 16KB FLASH 20DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC18LF13K22-ISS.pdf
(388 pages)
3.PIC18F14K22-EP.pdf
(4 pages)
Specifications of PIC18F14K22-E/P
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART, I2C, SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
18
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
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Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by all ports ................................................................................................................... 90 mA
Maximum current sourced by all ports ............................................................................................................. 90 mA
Note 1:
2010 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
I
OL
DD
DD
).
with respect to V
with respect to V
K
(V
PIN
(1)
DD
< 0 or V
............................................................................................................................... 800 mW
SS
pin ......................................................................................................................... 95 mA
pin ...................................................................................................................... 95 mA
PIN
SS
SS
, PIC18F1XK22 ........................................................................... -0.3V to +6.0V
, PIC18LF1XK22 ......................................................................... -0.3V to +4.0V
> V
(†)
DD
SS
)20 mA
........................................................................... -0.3V to (V
Preliminary
DIS
PIC18F1XK22/LF1XK22
= V
DD
x {I
DD
– I
OH
} + {(V
DD
– V
OH
) x I
DS41365D-page 331
OH
DD
} + (V
+ 0.3V)
O
l x
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