PIC16C710-20I/P Microchip Technology, PIC16C710-20I/P Datasheet - Page 114
![IC MCU OTP 512X14 A/D 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16C710-20I/P
Manufacturer Part Number
PIC16C710-20I/P
Description
IC MCU OTP 512X14 A/D 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C710-20I/P
Core Size
8-Bit
Program Memory Size
896B (512 x 14)
Oscillator Type
External
Core Processor
PIC
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Type
OTP
Ram Size
36 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Data Converters
A/D 4x8b
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Controller Family/series
PIC16C
No. Of I/o's
13
Ram Memory Size
36Byte
Cpu Speed
20MHz
No. Of Timers
2
Digital Ic
RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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PIC16C71X
13.2
DS30272A-page 114
Applicable Devices
DC CHARACTERISTICS
D002*
D003
D004*
D010
D010A
D015
D020
D021
D021A
D023
D001
D005
Note 1: This is the limit to which V
Param
No.
*
†
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
5: The
DC Characteristics:
These parameters are characterized but not tested.
and are not tested.
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
added to the base I
Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
Supply Voltage
RAM Data Retention
Voltage (Note 1)
V
ensure internal
Power-on Reset
signal
V
ensure internal
Power-on Reset
signal
Brown-out Reset
Voltage
Supply Current
(Note 2)
Brown-out Reset
Current (Note 5)
Power-down Current
(Note 3)
Brown-out Reset
Current (Note 5)
DD
DD
Characteristic
start voltage to
rise rate to
current is the additional current consumed when this peripheral is enabled. This current should be
DD
; WDT enabled/disabled as specified.
710 71 711 715
DD
or I
V
V
S
I
I
V
B
DD
PD
PD
DD
Sym
PIC16LC715-04 (Commercial, Industrial)
DD
DD
DR
POR
VDD
VDD
I
I
BOR
BOR
DD
measurement.
can be lowered in SLEEP mode without losing RAM data.
measurements in active operation mode are:
/2Rext (mA) with Rext in kOhm.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0.05
Min
2.5
3.7
-
-
-
-
-
-
-
-
-
Typ† Max Units
300*
300*
22.5
V
1.5
4.0
2.0
7.5
0.9
0.9
SS
-
-
500
500
5.5
4.3
3.8
48
30
5
5
-
-
-
V/ms See section on Power-on Reset for details
mA
V
V
V
V
A
A
A
A
A
A
0˚C
-40˚C
LP, XT, RC osc configuration (DC - 4 MHz)
Device in SLEEP mode
See section on Power-on Reset for details
BODEN configuration bit is enabled
XT, RC osc configuration
F
LP osc configuration
F
BOR enabled V
V
V
V
BOR enabled V
OSC
OSC
DD
DD
DD
= 3.0V, WDT enabled, -40 C to +85 C
= 3.0V, WDT disabled, 0 C to +70 C
= 3.0V, WDT disabled, -40 C to +85 C
= 4 MHz, V
= 32 kHz, V
T
T
A
A
+70˚C (commercial)
+85˚C (industrial)
DD
DD
DD
DD
Conditions
DD
1997 Microchip Technology Inc.
= 5.0V
= 5.0V
= 3.0V (Note 4)
= 3.0V, WDT disabled
DD
and V
SS
.
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