DSPIC33FJ06GS202-E/SO Microchip Technology, DSPIC33FJ06GS202-E/SO Datasheet - Page 306
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DSPIC33FJ06GS202-E/SO
Manufacturer Part Number
DSPIC33FJ06GS202-E/SO
Description
IC DSPIC MCU/DSP 6K 28-SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ06GS101-ISO.pdf
(346 pages)
2.DSPIC33FJ06GS101-ISO.pdf
(18 pages)
3.DSPIC33FJ06GS101-ISO.pdf
(16 pages)
Specifications of DSPIC33FJ06GS202-E/SO
Program Memory Type
FLASH
Program Memory Size
6KB (6K x 8)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
1 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ06GS202-E/SO
Manufacturer:
Microchip Technology
Quantity:
135
- DSPIC33FJ06GS101-ISO PDF datasheet
- DSPIC33FJ06GS101-ISO PDF datasheet #2
- DSPIC33FJ06GS101-ISO PDF datasheet #3
- Current page: 306 of 346
- Download datasheet (6Mb)
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
FIGURE 24-12:
TABLE 24-31: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
DS70318D-page 304
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP36
SP40
SP41
Note 1:
Param
No.
Note: Refer to Figure 24-1 for load conditions.
SCK
(CKP = 0)
(CKP = 1)
SDO
SDI
SCK
2:
3:
4:
X
X
X
X
TscL
TscH
TscL2doV
TdoV2sc,
TdoV2scL
TdiV2scH,
TdiV2scL
TscL2diL
TscF
TscR
TdoF
TdoR
TscH2doV,
TscH2diL,
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. The clock generated in Master mode must not violate this
specification.
Assumes 50 pF load on all SPIx pins.
Symbol
SP36
SPIx MODULE MASTER MODE (CKE = 1) TIMING CHARACTERISTICS
SCKx Output Low Time
SCKx Output High Time
SCKx Output Fall Time
SCKx Output Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data
Input to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
SP40
MSb In
MSb
Characteristic
SP11
SP41
SP30,SP31
SP35
SP10
(1)
Bit 14 - - - - - -1
Bit 14 - - - -1
Preliminary
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
T
T
Min
CY
CY
30
23
30
—
—
—
—
—
/2
/2
Typ
SP21
SP20
—
—
—
—
—
—
—
—
—
6
LSb In
(2)
LSb
Max
SP21
SP20
20
—
—
—
—
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
Units
© 2009 Microchip Technology Inc.
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
See Note 3
See Note 3
See parameter D032
and Note 4
See parameter D031
and Note 4
See parameter D032
and Note 4
See parameter D031
and Note 4
Conditions
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