PIC24FJ32GA102-I/SO Microchip Technology, PIC24FJ32GA102-I/SO Datasheet - Page 22
![IC MCU 16BIT 32KB FLASH 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC24FJ32GA102-I/SO
Manufacturer Part Number
PIC24FJ32GA102-I/SO
Description
IC MCU 16BIT 32KB FLASH 28SOIC
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr
Datasheets
1.PIC24FJ32GA102-ISP.pdf
(308 pages)
2.PIC24FJ32GA102-ISP.pdf
(12 pages)
3.PIC24FJ32GA102-ISP.pdf
(48 pages)
4.PIC24FJ64GA104-IML.pdf
(300 pages)
Specifications of PIC24FJ32GA102-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (11K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/IrDA/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM240001, MA240020, DM240002, DM240011, DV164033
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC24FJ32GA102-ISP PDF datasheet
- PIC24FJ32GA102-ISP PDF datasheet #2
- PIC24FJ32GA102-ISP PDF datasheet #3
- PIC24FJ64GA104-IML PDF datasheet #4
- Current page: 22 of 308
- Download datasheet (3Mb)
PIC24FJ64GA104 FAMILY
2.6
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 8.0 “Oscillator Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-4. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins and other signals
in close proximity to the oscillator are benign (i.e., free
of high frequencies, short rise and fall times and other
similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
• AN849, “Basic PICmicro
• AN943, “Practical PICmicro
• AN949, “Making Your Oscillator Work”
DS39951C-page 22
Selection for rfPIC™ and PICmicro
and Design”
External Oscillator Pins
Secondary
®
Oscillator Design”
®
Oscillator
Oscillator Analysis
®
Devices”
(refer
to
FIGURE 2-4:
(tied to ground)
Bottom Layer
Copper Pour
Oscillator
Secondary
Primary
Oscillator
Crystal
GND
OSCO
OSCI
C1
C2
Sec Oscillator: C1
DEVICE PINS
(tied to ground)
Single-Sided and In-line Layouts:
Copper Pour
Fine-Pitch (Dual-Sided) Layouts:
`
`
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Top Layer Copper Pour
(tied to ground)
2010 Microchip Technology Inc.
`
Primary Oscillator
Sec Oscillator: C2
Crystal
DEVICE PINS
C2
C1
Oscillator
OSCI
OSCO
GND
SOSCO
SOSC I
Crystal
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