PIC18LF26J50-I/ML Microchip Technology, PIC18LF26J50-I/ML Datasheet - Page 8

• Manufacturer Part Number: PIC18LF26J50-I/ML
• Description: IC PIC MCU FLASH 64K 2V 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18LF26J50-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 64KB (32K x 16)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 16
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: EUSART, I2C, SPI
• Maximum Clock Frequency: 31 KHz
• Number Of Programmable I/os: 16
• Number Of Timers: 5
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DV164136, MA180024, DM183022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• A/d Bit Size: 10 bit
• A/d Channels Available: 10
• Height: 0.88 mm
• Length: 6 mm
• Supply Voltage (max): 2.75 V, 3.6 V
• Supply Voltage (min): 2 V
• Width: 6 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F46J50 FAMILY
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the Device Data
Sheet (DS39931C):
1. Module: Special Features (CONFIG2L)
2. Module: DC Characteristics
DS80436C-page 8
Note:
The “T1DIG” feature mentioned in the Device
Data Sheet (DS39931C) is not implemented in
this device family. The feature, associated with
bit 3 of the CONFIG2L Configuration register, is
discussed in Section 26.1 “Configuration
Bits” and Section 2.5.1 “Oscillator Control
Register”.
For application firmware to switch to the Timer1
clock source, it must first enable the crystal
driver by setting the T1OSCEN bit (T1CON<3>).
The microcontroller will ignore attempts to clock
switch to the Timer1 clock source when the
crystal driver is disabled.
Section 29.2 “DC Characteristics: Power-
Down and Supply Current” lists the maximum
Power-Down (I
PIC18FXXJ50 devices, operating at V
and -40°C, and 25°C at 5 A.
The correct maximum is 6 A.
Corrections are shown in bold. Where
possible, the original bold text formatting
has been removed for clarity.
(Power-Down Current)
PD
) Sleep mode current for
DD
= 2.15V
3. Module: DC Characteristics (Input
In Table 29-7 USB Module Specifications,
electrical parameter D314 indicates the D+ and
D- pin leakage is +/-0.2 A maximum. The
updated specification is +/-0.5 A maximum,
over the -40°C to +85°C temperature range.
The input leakage specification for all other I/O
pins remains unchanged at the +/-0.2 A maxi-
mum level, as indicated by electrical parameters
D060, D061 and D063 (I
Characteristics”.
Leakage)
 2010 Microchip Technology Inc.
IL
), in Section 29.3 “DC