PIC18F4331-E/PT Microchip Technology, PIC18F4331-E/PT Datasheet - Page 380
PIC18F4331-E/PT
Manufacturer Part Number
PIC18F4331-E/PT
Description
IC MCU FLASH 4KX16 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC18F2331-ISO.pdf
(392 pages)
4.PIC18F2331-ISO.pdf
(8 pages)
5.PIC18F2331-ISO.pdf
(6 pages)
6.PIC18F2331-ISO.pdf
(16 pages)
7.PIC18LF2331-ISO.pdf
(40 pages)
8.PIC18F4331-EP.pdf
(400 pages)
Specifications of PIC18F4331-E/PT
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
36
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
44-TQFP, 44-VQFP
Controller Family/series
PIC18
No. Of I/o's
36
Eeprom Memory Size
256Byte
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB18F4431 - BOARD DAUGHTER ICEPIC3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F4331-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC18F2331-ISO PDF datasheet #3
- PIC18F2331-ISO PDF datasheet #4
- PIC18F2331-ISO PDF datasheet #5
- PIC18F2331-ISO PDF datasheet #6
- PIC18LF2331-ISO PDF datasheet #7
- PIC18F4331-EP PDF datasheet #8
- Current page: 380 of 400
- Download datasheet (7Mb)
PIC18F2331/2431/4331/4431
DS39616C-page 378
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
D
e
A
E
b
L
c
e
A2
1.980
.125
.015
.590
.485
.008
.030
.014
MIN
.115
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
© 2007 Microchip Technology Inc.
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
c
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