DSPIC30F2020-30I/MMB32 Microchip Technology, DSPIC30F2020-30I/MMB32 Datasheet - Page 11

• Manufacturer Part Number: DSPIC30F2020-30I/MMB32
• Description: IC DSPIC MCU/DSP 12K 28QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2020-30I/MMB32

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-QFN
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Other names: Q4035438A

1.0
© 2006 Microchip Technology Inc.
Note: This data sheet summarizes features of this group
of dsPIC30F devices and is not intended to be a complete
reference source. For more information on the CPU,
peripherals, register descriptions and general device
functionality, refer to the “dsPIC30F Family Reference
Manual” (DS70046). For more information on the device
instruction set and programming, refer to the “dsPIC30F/
33F Programmer’s Reference Manual” (DS70157).
DEVICE OVERVIEW
Preliminary
This document contains device specific information for
the dsPIC30F1010/202X SMPS devices. These devices
contain extensive Digital Signal Processor (DSP) func-
tionality within a high-performance 16-bit microcontroller
(MCU) architecture, as reflected in the following block
diagrams. Figure 1-1 and Table 1-1 describe the
dsPIC30F1010 SMPS device, Figure 1-2 and Table 1-2
describe the dsPIC30F2020 device and Figure 1-3 and
Table 1-3 describe the dsPIC30F2023 SMPS device.
dsPIC30F1010/202X
DS70178C-page 9