DSPIC30F3013-20I/SP Microchip Technology, DSPIC30F3013-20I/SP Datasheet - Page 45
DSPIC30F3013-20I/SP
Manufacturer Part Number
DSPIC30F3013-20I/SP
Description
IC DSPIC MCU/DSP 24K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(210 pages)
2.DSPIC30F2011-20ISO.pdf
(6 pages)
3.DSPIC30F3012-20ISO.pdf
(14 pages)
4.DSPIC30F3012-20ISO.pdf
(20 pages)
5.DSPIC30F2012-30ISO.pdf
(205 pages)
Specifications of DSPIC30F3013-20I/SP
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F301320ISP
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20ISO PDF datasheet #2
- DSPIC30F3012-20ISO PDF datasheet #3
- DSPIC30F3012-20ISO PDF datasheet #4
- DSPIC30F2012-30ISO PDF datasheet #5
- Current page: 45 of 205
- Download datasheet (3Mb)
4.2.1
The Modulo Addressing scheme requires that a start-
ing and an ending address be specified and loaded
into the 16-bit
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Table 3-3).
The length of a circular buffer is not directly specified. It
is determined by the difference between the corre-
sponding Start and end addresses. The maximum pos-
sible length of the circular buffer is 32K words
(64 Kbytes).
FIGURE 4-1:
© 2006 Microchip Technology Inc.
Note:
Byte
Address
0x1100
0x1163
START AND END ADDRESS
Y space Modulo Addressing EA calcula-
tions assume word-sized data (LSb of
every EA is always clear).
Start Addr = 0x1100
End Addr = 0x1163
Length = 0x0032 words
Modulo
MODULO ADDRESSING OPERATION EXAMPLE
Buffer
Address
dsPIC30F2011/2012/3012/3013
registers:
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
DO
MOV
AGAIN: INC
#0x1100,W0
W0,XMODSRT
#0x1163,W0
W0,MODEND
#0x8001,W0
W0,MODCON
#0x0000,W0
#0x1110,W1
AGAIN,#0x31
W0,[W1++]
W0,W0
4.2.2
The Modulo and Bit-Reversed Addressing Control reg-
ister, MODCON<15:0>, contains enable flags as well
as a W register field to specify the W address registers.
The XWM and YWM fields select which registers oper-
ate with Modulo Addressing. If XWM = 15, X RAGU
and X WAGU Modulo Addressing is disabled. Similarly,
if YWM = 15, Y AGU Modulo Addressing is disabled.
The X Address Space Pointer W register (XWM), to
which Modulo Addressing is to be applied, is stored in
MODCON<3:0> (see Table 3-3). Modulo Addressing is
enabled for X data space when XWM is set to any value
other than ‘15’ and the XMODEN bit is set at
MODCON<15>.
The Y Address Space Pointer W register (YWM), to
which Modulo Addressing is to be applied, is stored in
MODCON<7:4>. Modulo Addressing is enabled for Y
data space when YWM is set to any value other than
‘15’ and the YMODEN bit is set at MODCON<14>.
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;W0 holds buffer fill value
;point W1 to buffer
;fill the 50 buffer locations
;fill the next location
;increment the fill value
W ADDRESS REGISTER
SELECTION
DS70139E-page 43
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