DSPIC33FJ64GS608-E/PT Microchip Technology, DSPIC33FJ64GS608-E/PT Datasheet - Page 354
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC33FJ64GS608-E/PT
Manufacturer Part Number
DSPIC33FJ64GS608-E/PT
Description
MCU/DSP 16BIT 64KB FLASH 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ32GS406-IPT.pdf
(418 pages)
Specifications of DSPIC33FJ64GS608-E/PT
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
80-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
Number Of I /o
74
Ram Size
9K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Numeric And Arithmetic Format
Fixed-Point or Floating-Point
Instruction Set Architecture
Harvard
Device Million Instructions Per Second
40 MIPs
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
74
Data Ram Size
4 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 18 Channel
On-chip Dac
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ64GS608-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ64GS608-E/PT
Manufacturer:
MIC
Quantity:
20 000
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dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
27.1
TABLE 27-1:
TABLE 27-2:
TABLE 27-3:
DS70591C-page 354
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 64-Pin QFN (9x9x0.9 mm)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
Package Thermal Resistance, 80-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm)
Note 1:
Characteristic
DC Characteristics
P
I/O = ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
– I
Range
} x I
Rating
OH
OH
)
) + (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33FJ32GS406/606/608/610 and
dsPIC33FJ64GS406/606/608/610
53.1
Min
Typ
-40
-40
-40
-40
28
39
43
43
(T
2010 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
+ P
A
)/
40
40
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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