PIC16C66-10I/SP Microchip Technology, PIC16C66-10I/SP Datasheet - Page 200

• Manufacturer Part Number: PIC16C66-10I/SP
• Description: IC MCU OTP 8KX14 PWM 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C66-10I/SP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: OTP
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

PIC16C6X
19.1
DS30234D-page 200
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
DC CHARACTERISTICS
D002*
D003
D004*
D005
D010
D013
D015*
D020
D021
D021A
D021B
D023*
Note 1: This is the limit to which V
D001
D001A
Param
No.
*
†
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
6: The
These parameters are characterized but not tested.
Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only and
are not tested.
DC Characteristics:
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
ization and is for design guidance only. This is not tested.
added to the base I
Supply Voltage
RAM Data Retention
Voltage (Note 1)
V
ensure internal Power-on
Reset signal
V
internal Power-on Reset
signal
Brown-out Reset Voltage
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
DD
DD
rise rate to ensure
start voltage to
Characteristic
current is the additional current consumed when this peripheral is enabled. This current should be
DD
; WDT enabled/disabled as specified.
DD
or I
PD
DD
DD
PIC16C62A/R62/64A/R64-04 (Commercial, Industrial, Extended)
PIC16C62A/R62/64A/R64-10 (Commercial, Industrial, Extended)
PIC16C62A/R62/64A/R64-20 (Commercial, Industrial, Extended)
DD
Standard Operating Conditions (unless otherwise stated)
Operating temperature
V
V
S
I
I
measurement.
V
B
can be lowered without losing RAM data.
DD
PD
measurements in active operation mode are:
/2Rext (mA) with Rext in kOhm.
Sym
DD
DR
POR
VDD
VDD
I
I
BOR
BOR
0.05
Min
4.0
4.5
3.7
3.7
-
-
-
-
-
-
-
-
-
-
Typ† Max Units
10.5
V
350
350
1.5
4.0
4.0
2.7
1.5
1.5
2.5
10
SS
-
-
-
425
425
6.0
5.5
4.3
4.4
20
42
16
19
19
5
-
-
-
-40˚C
-40˚C
0˚C
V/ms See section on Power-on Reset for details
mA
mA
V
V
V
V
V
V
A
A
A
A
A
A
T
T
T
XT, RC and LP osc configuration
HS osc configuration
See section on Power-on Reset for details
BODEN bit in configuration word enabled
Extended Range Only
XT, RC, osc configuration F
V
HS osc configuration F
V
BOR enabled, V
V
V
V
V
BOR enabled, V
A
A
A
DD
DD
DD
DD
DD
DD
= 5.5V (Note 4)
= 5.5V
= 4.0V, WDT enabled, -40 C to +85 C
= 4.0V, WDT disabled, -0 C to +70 C
= 4.0V, WDT disabled, -40 C to +85 C
= 4.0V, WDT disabled, -40 C to +125 C
+125˚C for extended,
+85˚C for industrial and
+70˚C for commercial
DD
1997 Microchip Technology Inc.
Conditions
DD
DD
= 5.0V
= 5.0V
DD
OSC
and V
OSC
= 20 MHz,
SS
= 4 MHz,
.