DSPIC33FJ64MC508-I/PT Microchip Technology, DSPIC33FJ64MC508-I/PT Datasheet - Page 354
DSPIC33FJ64MC508-I/PT
Manufacturer Part Number
DSPIC33FJ64MC508-I/PT
Description
IC DSPIC MCU/DSP 64K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.MA330013.pdf
(370 pages)
2.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
3.PIC24HJ12GP201-ISO.pdf
(84 pages)
4.DSPIC33FJ64MC506-IPT.pdf
(340 pages)
5.DSPIC33FJ64MC506-IPT.pdf
(30 pages)
Specifications of DSPIC33FJ64MC508-I/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TFQFP
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
69
Flash Memory Size
64KB
Supply Voltage Range
3V To 3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDMA330013 - MODULE PLUG-IN DSPIC33 100TQFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164328 - MODULE SKT FOR 80TQFP
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ64MC508-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ64MC508-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- MA330013 PDF datasheet
- DSPIC33FJ12GP201-ISO PDF datasheet #2
- PIC24HJ12GP201-ISO PDF datasheet #3
- DSPIC33FJ64MC506-IPT PDF datasheet #4
- DSPIC33FJ64MC506-IPT PDF datasheet #5
- Current page: 354 of 370
- Download datasheet (6Mb)
dsPIC33F
27.2
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70165E-page 352
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
D
D1
L
Dimension Limits
Preliminary
E1
NOTE 2
Units
D1
A2
A1
L1
E1
N
A
E
D
e
L
c
b
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
A2
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