DSPIC33FJ64MC508-I/PT Microchip Technology, DSPIC33FJ64MC508-I/PT Datasheet - Page 357
DSPIC33FJ64MC508-I/PT
Manufacturer Part Number
DSPIC33FJ64MC508-I/PT
Description
IC DSPIC MCU/DSP 64K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.MA330013.pdf
(370 pages)
2.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
3.PIC24HJ12GP201-ISO.pdf
(84 pages)
4.DSPIC33FJ64MC506-IPT.pdf
(340 pages)
5.DSPIC33FJ64MC506-IPT.pdf
(30 pages)
Specifications of DSPIC33FJ64MC508-I/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TFQFP
Core Frequency
40MHz
Core Supply Voltage
2.75V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
69
Flash Memory Size
64KB
Supply Voltage Range
3V To 3.6V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDMA330013 - MODULE PLUG-IN DSPIC33 100TQFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164328 - MODULE SKT FOR 80TQFP
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ64MC508-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ64MC508-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- MA330013 PDF datasheet
- DSPIC33FJ12GP201-ISO PDF datasheet #2
- PIC24HJ12GP201-ISO PDF datasheet #3
- DSPIC33FJ64MC506-IPT PDF datasheet #4
- DSPIC33FJ64MC506-IPT PDF datasheet #5
- Current page: 357 of 370
- Download datasheet (6Mb)
© 2007 Microchip Technology Inc.
100-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
c
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
e
β
N
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
Preliminary
NOTE 2
E1
φ
L
Units
A2
A1
E1
D1
L1
N
A
E
D
α
e
L
φ
c
b
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.17
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
100
12°
12°
–
–
–
Microchip Technology Drawing C04-110B
MAX
1.20
0.15
0.75
0.27
1.05
0.20
13°
13°
dsPIC33F
7°
DS70165E-page 355
A2
α
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