DSPIC30F6014A-20E/PT Microchip Technology, DSPIC30F6014A-20E/PT Datasheet - Page 140

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DSPIC30F6014A-20E/PT

Manufacturer Part Number
DSPIC30F6014A-20E/PT
Description
IC DSPIC MCU/DSP 144K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6014A-20E/PT

Program Memory Type
FLASH
Program Memory Size
144KB (48K x 24)
Package / Case
80-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
68
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
68
Data Ram Size
8 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
Minimum Operating Temperature
- 40 C
Package
80TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6014A-20E/PT
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
DSPIC30F6014A-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC30F6011A/6012A/6013A/6014A
FIGURE 19-3:
19.8
The analog input model of the 12-bit ADC is shown in
Figure 19-4. The total sampling time for the ADC is a
function of the internal amplifier settling time and the
holding capacitor charge time.
For the ADC to meet its specified accuracy, the charge
holding capacitor (C
charge to the voltage level on the analog input pin. The
source impedance (R
(R
FIGURE 19-4:
DS70143C-page 138
IC
Instruction Execution BSET ADCON1, ASAM
) and the internal sampling switch (R
ADCBUF0
ADCBUF1
ADCLK
DONE
SAMP
ADC Acquisition Requirements
Note: C
Legend: C
VA
PIN
HOLD
Rs
S
value depends on device package and is not tested. Effect of C
CONVERTING 1 CHANNEL AT 200 KSPS, AUTO-SAMPLE START, 1 T
SAMPLING TIME
12-BIT ADC ANALOG INPUT MODEL
), the interconnect impedance
V
I leakage
R
R
C
ANx
) must be allowed to fully
T
PIN
IC
SS
HOLD
C
PIN
= 1 T
T
SAMP
= input capacitance
= threshold voltage
= leakage current at the pin due to
= interconnect resistance
= sampling switch resistance
= sample/hold capacitance (from DAC)
AD
various junctions
V
SS
DD
V
) imped-
V
T
T
= 0.6V
= 0.6V
Preliminary
= 14 T
T
CONV
AD
R
I leakage
= 1 T
T
IC
SAMP
500 nA
AD
250
ance combine to directly affect the time required to
charge the capacitor C
of the analog sources must therefore be small enough
to fully charge the holding capacitor within the chosen
sample time. To minimize the effects of pin leakage
currents on the accuracy of the ADC, the maximum
recommended source impedance, R
the analog input channel is selected (changed), this
sampling function must be completed prior to starting
the conversion. The internal holding capacitor will be in
a discharged state prior to each sample operation.
Sampling
Switch
R
SS
= 14 T
PIN
T
CONV
R
negligible if Rs
SS
V
AD
SS
C
= DAC capacitance
= 18 pF
HOLD
HOLD
3 k
© 2006 Microchip Technology Inc.
. The combined impedance
2.5 k .
S
, is 2.5 k . After
AD

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