DSPIC30F6014A-20E/PT Microchip Technology, DSPIC30F6014A-20E/PT Datasheet - Page 218

• Manufacturer Part Number: DSPIC30F6014A-20E/PT
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014A-20E/PT

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 80-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 68
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPDM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC30F007 - MODULE SKT FOR DSPIC30F 80TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC30F6011A/6012A/6013A/6014A
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70143C-page 216
Note:
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
A
L
F
E
D
c
B
L
n
MIN
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
2
1
Preliminary
0
5
5
D1
.039 REF.
INCHES
CH x 45°
NOM
D
.024
.394
.394
.020
.043
.039
.006
.472
.472
.007
.009
.035
3.5
64
16
10
10
A1
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
F
15
15
7
MIN
11.75
11.75
0.64
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0
5
5
MILLIMETERS*
1.00 REF.
© 2006 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
0.18
0.22
0.89
Revised 07-22-05
3.5
64
16
10
10
MAX
A2
12.25
12.25
10.10
10.10
1.14
1.20
1.05
0.25
0.75
0.23
0.27
15
15
7