PIC18F8680-E/PT Microchip Technology, PIC18F8680-E/PT Datasheet - Page 469
PIC18F8680-E/PT
Manufacturer Part Number
PIC18F8680-E/PT
Description
IC PIC MCU FLASH 32KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XK1.pdf
(496 pages)
3.PIC18F6585-IPT.pdf
(8 pages)
4.PIC18F6585-IPT.pdf
(38 pages)
5.PIC18F6585-IPT.pdf
(14 pages)
Specifications of PIC18F8680-E/PT
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3328 B
Interface Type
I2C, SPI, AUSART, CAN
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
69
Number Of Timers
8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F8680-E/PT
Manufacturer:
HISILICON
Quantity:
5 000
Company:
Part Number:
PIC18F8680-E/PT
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
PIC18F8680-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PCM18XK1 PDF datasheet #2
- PIC18F6585-IPT PDF datasheet #3
- PIC18F6585-IPT PDF datasheet #4
- PIC18F6585-IPT PDF datasheet #5
- Current page: 469 of 496
- Download datasheet (9Mb)
68-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
2004 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-049
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
CH2 x 45
#leads=n1
n
E2
Dimension Limits
E1
E
1
2
CH1 x 45
Units
CH1
CH2
A2
A1
A3
E1
D1
E2
D2
B1
n1
A
D
n
p
E
c
B
PIC18F6585/8585/6680/8680
D1
MIN
D
A2
.165
.145
.020
.024
.040
.000
.985
.985
.950
.950
.890
.890
.008
.026
.013
0
0
32
INCHES*
NOM
A
.050
.173
.153
.028
.029
.045
.005
.990
.990
.954
.954
.920
.920
.011
.029
.020
68
17
5
5
A3
MAX
.180
.160
.035
.034
.050
.010
.995
.995
.958
.958
.930
.930
.013
.032
.021
10
10
B1
B
MIN
24.13
24.13
25.02
25.02
22.61
22.61
4.19
3.68
0.51
0.61
1.02
0.00
0.20
0.66
0.33
D2
0
0
MILLIMETERS
p
NOM
25.15
25.15
24.23
24.23
23.37
23.37
1.27
4.39
3.87
0.71
0.74
1.14
0.13
0.27
0.74
0.51
68
17
5
5
DS30491C-page 467
A1
MAX
25.27
25.27
24.33
24.33
23.62
23.62
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.81
0.53
10
10
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