ATSAM3S2AA-MU Atmel, ATSAM3S2AA-MU Datasheet - Page 16

• Manufacturer Part Number: ATSAM3S2AA-MU
• Description: IC MCU 32BIT 128KB FLASH 48QFN
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S2AA-MU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 8x10/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

4.3.1
Table 4-4.
Note:
16
10
11
12
1
2
3
4
5
6
7
8
9
The bottom pad of the QFN package must be connected to ground.
PA17/PGMD5/
PA18/PGMD6/
PA19/PGMD7/
SAM3S Summary
48-Lead LQFP and QFN Pinout
PA20/AD3
VDDOUT
PB0/AD4
PB1/AD5
PB2/AD6
PB3/AD7
ADVREF
VDDIN
GND
AD0
AD1
AD2
48-pin SAM3S4/2/1A Pinout
13
14
15
16
17
18
19
20
21
22
23
24
PA11/PGMM3
PA10/PGMM2
PA16/PGMD4
PA15/PGMD3
PA14/PGMD2
PA13/PGMD1
PA12/PGMD0
PA8/XOUT32/
PGMNVALID
PA9/PGMM1
PA7/XIN32/
VDDCORE
PGMM0
VDDIO
25
26
27
28
29
30
31
32
33
34
35
36
PA4/PGMNCMD
PA6/PGMNOE
PA5/PGMRDY
PA2/PGMEN2
PA1/PGMEN1
PA0/PGMEN0
TDI/PB4
VDDIO
NRST
GND
TST
PA3
37
38
39
40
41
42
43
44
45
46
47
48
6500CS–ATARM–24-Jan-11
TDO/TRACESWO/
TMS/SWDIO/PB6
TCK/SWCLK/PB7
XIN/PB9/PGMCK
ERASE/PB12
VDDCORE
DDM/PB10
XOUT/PB8
DDP/PB11
JTAGSEL
VDDPLL
VDDIO
PB5