AT32UC3B1256-AUT Atmel, AT32UC3B1256-AUT Datasheet - Page 55
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AT32UC3B1256-AUT
Manufacturer Part Number
AT32UC3B1256-AUT
Description
IC MCU AVR32 256KB FLASH 48-TQFP
Manufacturer
Atmel
Series
AVR®32 UC3r
Specifications of AT32UC3B1256-AUT
Core Processor
AVR
Core Size
32-Bit
Speed
60MHz
Connectivity
I²C, IrDA, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
28
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TQFP, 48-VQFP
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
2-Wire/SPI/USART
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
28
Number Of Timers
3
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1101
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
Controller Family/series
AVR UC3
No. Of I/o's
28
Ram Memory Size
32KB
Cpu Speed
60MHz
No. Of Timers
1
Rohs Compliant
Yes
For Use With
ATSTK600-TQFP48 - STK600 SOCKET/ADAPTER 48-TQFPATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMR770-1008 - ISP 4PORT ATMEL AVR32 MCU SPIATEVK1101 - KIT DEV/EVAL FOR AVR32 AT32UC3B
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AT32UC3B1256-AUT
Manufacturer:
ATMEL
Quantity:
1 000
10. Mechanical Characteristics
10.1
10.1.1
10.1.2
32059K–03/2011
Thermal Considerations
Thermal Data
Junction Temperature
Table 10-1
Table 10-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
page
Table 10-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
55.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
55.
JA
)
42.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Package
TQFP64
TQFP64
TQFP48
TQFP48
AT32UC3B
Table 10-1 on
49.6
13.5
51.1
13.7
Typ
”Power
J
⋅C/W
⋅C/W
in °C.
Unit
55