ATXMEGA256D3-AU Atmel, ATXMEGA256D3-AU Datasheet - Page 87

• Manufacturer Part Number: ATXMEGA256D3-AU
• Description: MCU AVR 256KB FLASH 64TQFP
• Manufacturer: Atmel
• Series: AVR® XMEGAr

Specifications of ATXMEGA256D3-AU

• Core Processor: AVR
• Core Size: 8/16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 50
• Program Memory Size: 256KB (128K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.6 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP, 64-VQFP
• Processor Series: XMEGA
• Core: AVR
• Data Bus Width: 8 bit, 16 bit
• Data Ram Size: 16 KB
• Interface Type: SPI, TWI, USART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 50
• Number Of Timers: 5
• Operating Supply Voltage: 2.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR, EWAVR-BL
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

32.2
8134I–AVR–12/10
64M2
K
R
Notes: 1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD.
2325 Orchard Parkway
San Jose, CA 95131
L
E2
2. Dimension and tolerance conform to ASMEY14.5M-1994.
Marked Pin# 1 ID
K
BOTTOM VIEW
b
TOP VIEW
D2
D
TITLE
64M2, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm,
7.65 mm Exposed Pad, Micro Lead Frame Package (MLF)
e
1
2
3
E
Pin #1 Corner
Option C
Option A
Option B
Pin #1
Triangle
Pin #1
Chamfer
(C 0.30)
Pin #1
Notch
(0.20 R)
SYMBOL
A
SIDE VIEW
A
A1
A3
b
D
D2
E
E2
e
L
K
0.80
0.18
8.90
7.50
8.90
7.50
0.35
0.20
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
A1
–
A3
C
0.08
SEATING PLANE
0.50 BSC
0.20 REF
NOM
0.90
0.02
0.25
9.00
7.65
9.00
7.65
0.40
0.27
C
DRAWING NO.
XMEGA D3
MAX
0.30
9.10
7.80
9.10
7.80
0.45
0.40
1.00
0.05
64M2
2010-10-20
NOTE
REV.
E
87