STM32F101C8U6 STMicroelectronics, STM32F101C8U6 Datasheet - Page 80
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STM32F101C8U6
Manufacturer Part Number
STM32F101C8U6
Description
MCU 32BIT ARM 128K FLASH 48-QFN
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F101T8U6.pdf
(87 pages)
Specifications of STM32F101C8U6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP Exposed Pad, 48-eLQFP, 48-HLQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
10 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
37
Number Of Timers
3
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
497-10030 - STARTER KIT FOR STM32497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F101C8U6
Manufacturer:
ST
Quantity:
185
Company:
Part Number:
STM32F101C8U6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Revision history
8
80/87
Revision history
Table 54.
06-Jun-2007
20-Jul-07
Date
Document revision history
Revision
1
2
I
and Sleep modes (TA = 85
V
V
characteristics.
Note 6
Medium-density STM32F101xx pin
Figure 20: Low-speed external clock source AC timing
Figure 11: Power supply
protection
circuit(1)
Sample size modified and machine model removed in
discharge
Number of parts modified and standard reference updated in
latch-up. 25 °C and 85 °C conditions removed and class name modified
in
t
characteristics.
In
endurance added, data retention for T
retention for T
operating
V
voltage. I
consumption in Run and Sleep modes (TA = 85
I
R
characteristics. R
characteristics
Datasheet title corrected. USB characteristics section removed.
Features on page 1
First draft.
DD
SU(LSE)
DD(HSI)
BAT
REF+
BG
PU
Table 32: Electrical
Table 28: Flash memory endurance and data
values modified in
changed to V
and R
Doc ID 13586 Rev 14
range modified in
min value, t
modified and
max value added to
changed to t
DD
modified.
conditions.
(ESD).
and
PD
max values added to
A
min and max values added to
Figure 29: I2C bus AC waveforms and measurement
(two notes removed).
Table 38: TIMx characteristics
= 85 °C added. Note removed below
PU
REFINT
STAB
list optimized. Small text changes.
min and max values added to
SU(LSE)
Note
sensitivities.
Table 11: Maximum current consumption in Run
, t
Power supply
lat
scheme,
in
8,
and f
°C).
Table 11: Embedded internal reference
in
Table 23: HSI oscillator
Note 5
Table 21: HSE 4-16 MHz oscillator
Changes
TRIG
Table 11: Maximum current
Figure 28: Recommended NRST pin
definitions.
and
added to
schemes.
A
STM32F101x8, STM32F101xB
= 25 °C removed and data
Note 7
Table 34: I/O static
modified.
Table 42: ADC
added below
retention, typical
°C).
Table 37: NRST pin
characteristics.
Table 8: General
Electrostatic
diagram,
Table 4:
Static