STR712FR2T6 STMicroelectronics, STR712FR2T6 Datasheet - Page 48

IC MCU ARM7 TDMI 256K 64-LQFP

STR712FR2T6

Manufacturer Part Number
STR712FR2T6
Description
IC MCU ARM7 TDMI 256K 64-LQFP
Manufacturer
STMicroelectronics
Series
STR7r
Datasheet

Specifications of STR712FR2T6

Core Processor
ARM7
Core Size
32-Bit
Speed
66MHz
Connectivity
CAN, EBI/EMI, HDLC, I²C, SmartCard, SPI, UART/USART
Peripherals
PWM, WDT
Number Of I /o
32
Program Memory Size
256KB (256K x 8 + 16K)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STR712x
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN/EMI/USB
Maximum Clock Frequency
66 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR7, KSK-STR712-PL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STR710-SK/HIT, STR71X-SK/RAIS, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 12-bit
Cpu Family
STR7
Device Core
ARM7TDMI
Device Core Size
32b
Frequency (max)
66MHz
Total Internal Ram Size
64KB
# I/os (max)
32
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
TQFP
For Use With
MCBSTR7UME - MCBSTR7 + ULINK-ME DEV KITMCBSTR7 - BOARD EVAL STM STR71X SERIES497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU497-4886 - KIT STARTER FOR STR712F ARM MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-4515

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Electrical parameters
48/78
Table 25.
Electro magnetic interference (EMI)
Based on a simple application running on the product (toggling 2 LEDs through the I/O
ports), the product is monitored in terms of emission. This emission test is in line with the
norm SAE J 1752/3 which specifies the board and the loading of each pin.
Table 26.
Notes:
1. Not tested in production.
2. BGA and LQFP devices have similar EMI characteristics.
Absolute maximum ratings (electrical sensitivity)
Based on three different tests (ESD, LU and DLU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity.
For more details, refer to the application note AN1181.
Electro-static discharge (ESD)
Electro-Static Discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts*(n+1) supply pin). Two models
can be simulated: Human Body Model and Machine Model. This test conforms to the
JESD22-A114A/A115A standard.
Symbol
Symbol
V
V
FESD
EFTB
S
EMI
Voltage limits to be applied on any I/O pin
to induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100pF on V
pins to induce a functional disturbance
Peak level
EMS data
EMI data
Parameter
Parameter
V
LQFP64 package
conforming to SAE J
1752/3
33
=3.3 V, T
Conditions
DD
A
and V
=+25°C,
SS
0.1 MHz to 30 MHz
30 MHz to 130 MHz
130 MHz to 1 GHz
SAE EMI Level
frequency band
V
conforms to IEC 1000-4-2
V
conforms to IEC 1000-4-4
33
33
Monitored
=3.3 V, T
=3.3 V, T
A
A
Conditions
=+25°C, f
=+25°C, f
16/ 48
MHz
[f
17
17
11
OSC4M
4
MCLK
MCLK
Max vs.
=32 MHz
=32 MHz
/f
HCLK
MHz
16/8
19
16
11
3
]
STR71xF
Level/
Class
dBµV
Unit
2B
4A
-

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