STR912FAW46X6 STMicroelectronics, STR912FAW46X6 Datasheet - Page 45

MCU ARM9 1024KB FLASH 128LQFP

STR912FAW46X6

Manufacturer Part Number
STR912FAW46X6
Description
MCU ARM9 1024KB FLASH 128LQFP
Manufacturer
STMicroelectronics
Series
STR9r
Datasheet

Specifications of STR912FAW46X6

Core Processor
ARM9
Core Size
32-Bit
Speed
96MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 2 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
128-LQFP
Processor Series
STR912x
Core
ARM966E-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
96 KB
Interface Type
CAN, I2C, IrDA, SSP, UART, USB
Maximum Clock Frequency
96 MHz
Number Of Programmable I/os
80
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MCBSTR9, MCBSTR9U, MCBSTR9UME, KSDK-STR912-PLUS, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
STR9
Device Core
ARM966E-S
Device Core Size
16/32Bit
Frequency (max)
96MHz
Total Internal Ram Size
96KB
# I/os (max)
80
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
2/3.6V
Operating Supply Voltage (min)
1.65/1.77/2.5/2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
128
Package Type
LQFP
For Use With
MCBSTR9UME - BOARD EVAL MCBSTR9 + ULINK-MEMCBSTR9U - BOARD EVAL MCBSTR9 + ULINK2MCBSTR9 - BOARD EVAL STM STR9 SERIES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-9038
STR912FAW46X6

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STR91xFAxxx
5.1
Table 7.
1.
2.
3.
10
11
12
1
2
3
4
5
6
7
8
9
No PHYCLK function on STR910F
No USBCLK function on STR910F
NU (Not Used) on STR910FAW devices. D10 is not connected, C11 must be pulled up by a 1.5 kOhm resistor to VDDQ.
RESET_
X1_CPU
X2_CPU
AVREF
AVDD
VSSQ
JTMS
OUTn
EMI_
WEn
P4.2
P4.6
P7.7
P1.5
A
LFBGA144 ball connections
STR91x LFBGA144 ball connections
PLLVSSQ
JRTCK
VDDQ
JTDO
P7.2
P4.1
P4.3
P4.5
P1.4
P1.2
P1.0
P0.7
B
In
future devices and should NOT be connected to ground or any other signal. There are
total of 9 NC (no connection) balls.
Balls H1 and G4 are assigned as EMI bus write signals (EMI_BWR_WRLn and
EMI_WRHn). These two balls can also be configured by the user as EMI low or high
byte select signals (EMI_LBn and EMI_UBn).
The PLLGND (B8) and PLLVDDQ (C9) balls can be connected to VSSQ and VDDQ.
Table 7
PLLVDDQ
USBDP
RESET_
VSSQ
AVSS
P4.0
P4.4
JTDI
P1.3
P1.1
NC
NC
INn
C
A
A
(2)
balls labelled NC are no connect balls. These NC balls are reserved for
W devices.
W devices.
USBDN
MDIO
JRSTn
VDDQ
VSSQ
VDD
P7.0
P7.1
P4.7
P1.7
MII_
P6.7
NC
D
(3)
(3)
TAMPER_
VDDQ
JTCK
P2.0
P2.1
P5.0
P7.5
P7.6
P6.6
P0.6
VSS
NC
IN
E
Doc ID 13495 Rev 6
VDDQ
VSSQ
P7.3
VSS
VDD
P5.1
P1.6
P0.5
NC
NC
NC
NC
F
EMI_BWR_
(EMI_LBn)
WRLn
VSSQ
VDD
P7.4
P6.2
P6.3
P2.6
P6.5
P6.4
VSS
P5.7
NC
G
EMI_WRHn
(EMI_UBn)
EMI_BAAn
VDDQ
P8.1
P6.0
P5.6
P0.4
P5.5
P0.3
P5.3
VSS
P9.4
H
VDDQ
VSSQ
EMI_
EMI_
P8.2
P6.1
P8.5
P2.5
P9.3
P3.3
P0.2
P5.4
RDn
ALE
J
PHYCLK_
P5.2
WAITn
VDDQ
VSSQ
EMI_
P8.7
P8.3
P2.3
P9.2
P3.0
P9.7
P0.1
P3.7
K
(1)
Pin description
USBCLK_
P2.7
VSSQ
VDDQ
VSSQ
P8.0
P8.4
P2.4
VDD
P9.5
P3.4
P3.5
P0.0
L
(2)
45/102
VBATT
BCLK
EMI_
P2.2
P8.6
RTC
RTC
P9.0
P9.1
P9.6
P3.1
P3.2
P3.6
X2_
X1_
M

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