MC9S08QG84CDNER Freescale Semiconductor, MC9S08QG84CDNER Datasheet - Page 19

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MC9S08QG84CDNER

Manufacturer Part Number
MC9S08QG84CDNER
Description
IC MCU 8BIT B54 RATING 8-SOIC
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08QG84CDNER

Core Processor
HCS08
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
4
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
For Use With
DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Section Number
17.3 On-Chip Debug System (DBG) .................................................................................................... 252
17.4 Register Definition ........................................................................................................................ 256
A.1 Introduction ....................................................................................................................................265
A.2 Absolute Maximum Ratings...........................................................................................................265
A.3 Thermal Characteristics..................................................................................................................266
A.4 ESD Protection and Latch-Up Immunity .......................................................................................268
A.5 DC Characteristics..........................................................................................................................269
A.6 Supply Current Characteristics.......................................................................................................272
A.7 External Oscillator (XOSC) and Internal Clock Source (ICS) Characteristics..............................274
A.8 AC Characteristics..........................................................................................................................276
A.9 Analog Comparator (ACMP) Electricals .......................................................................................282
A.10 ADC Characteristics.......................................................................................................................282
A.11 FLASH Specifications....................................................................................................................285
A.12 EMC Performance..........................................................................................................................286
B.1 Ordering Information .....................................................................................................................289
B.2 Mechanical Drawings.....................................................................................................................289
Freescale Semiconductor
17.2.4 BDC Hardware Breakpoint..............................................................................................251
17.3.1 Comparators A and B ......................................................................................................252
17.3.2 Bus Capture Information and FIFO Operation ................................................................252
17.3.3 Change-of-Flow Information ...........................................................................................253
17.3.4 Tag vs. Force Breakpoints and Triggers ..........................................................................253
17.3.5 Trigger Modes..................................................................................................................254
17.3.6 Hardware Breakpoints .....................................................................................................256
17.4.1 BDC Registers and Control Bits ......................................................................................256
17.4.2 System Background Debug Force Reset Register (SBDFR)...........................................258
17.4.3 DBG Registers and Control Bits......................................................................................259
A.8.1 Control Timing ................................................................................................................276
A.8.2 TPM/MTIM Module Timing ...........................................................................................277
A.8.3 SPI Timing .......................................................................................................................278
A.12.1 Radiated Emissions..........................................................................................................286
A.12.2 Conducted Transient Susceptibility .................................................................................286
B.1.1 Device Numbering Scheme .............................................................................................289
Ordering Information and Mechanical Drawings
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Electrical Characteristics
Appendix A
Appendix B
Title
Page
17

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