MC9S08SH16CTJ Freescale Semiconductor, MC9S08SH16CTJ Datasheet - Page 25

• Manufacturer Part Number: MC9S08SH16CTJ
• Description: MCU 8BIT 16K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08SH16CTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-TSSOP
• Processor Series: S08SH
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 2
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO, DEMO9S08SH32, DEMO9S08SH8
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Total Internal Ram Size: 1KB
• # I/os (max): 17
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.2
Figure 2-4
Freescale Semiconductor
V
NOTES:
DD
OPTIONAL
MANUAL
RESET
BACKGROUND HEADER
5 V
1. External crystal circuit not required if using the internal clock option.
2. RESET pin can only be used to reset into user mode, you can not enter BDM using RESET pin. BDM can be entered
3. RC filter on RESET pin recommended for noisy environments.
4. For the 16-pin and 20-pin packages: V
5. When PTA4 is configured as BKGD, pin becomes bi-directional.
SYSTEM
POWER
+
by holding MS low during POR or writing a 1 to BDFR in SBDFR with MS low after issuing BDM command.
Recommended System Connections
PTC0/TPM1CH0/ADP8
PTC1/TPM1CH1/ADP9
shows pin connections that are common to MC9S08SH32 Series application systems.
10 μF
C
BLK
+
PTC2/ADP10
PTC3/ADP11
PTC4/ADP12
PTC5/ADP13
PTC6/ADP14
PTC7/ADP15
V
DD
C
C
0.1 μF
0.1 μF
4.7 kΩ–10 kΩ
BY
BY
0.1 μF
Figure 2-4. Basic System Connections
MC9S08SH32 Series Data Sheet, Rev. 2
V
V
V
V
PORT
DD
SS
DDA
SSA
C
\V
DDA
\V
RESET
BKGD/MS
REFH
REFL
/V
MC9S08SH32
PRELIMINARY
REFH
and V
SSA
PORT
PORT
/V
A
B
REFL
are double bonded to V
C1
PTA0/PIA0/TPM1CH0/ADP0/ACMP+
PTA1/PIA1/TPM2CH0/ADP1/ACMP–
PTA2/PIA2/SDA/ADP2
PTA3/PIA3/SCL/ADP3
PTA4/ACMPO/BKGD/MS
PTA5/IRQ/TCLK/RESET
PTA6/TPM2CH0
PTA7/TPM2CH1
PTB0/PIB0/RxD/ADP4
PTB1/PIB1/TxD/ADP5
PTB2/PIB2/SPSCK/ADP6
PTB3/PIB3/MOSI/ADP7
PTB4/TPM2CH1/MISO
PTB5/TPM1CH1/SS
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
X1
Chapter 2 Pins and Connections
R
F
NOTE 1
DD
C2
and V
R
S
SS
respectively.
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