MC9S08AC16MFDE Freescale Semiconductor, MC9S08AC16MFDE Datasheet - Page 295
![IC MCU 8BIT 16K FLASH 48-QFN](/photos/12/34/123419/mc9s08ac16mfde_sml.jpg)
MC9S08AC16MFDE
Manufacturer Part Number
MC9S08AC16MFDE
Description
IC MCU 8BIT 16K FLASH 48-QFN
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08AC8CFGE.pdf
(336 pages)
Specifications of MC9S08AC16MFDE
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
38
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
48-QFN
Processor Series
S08AC
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
38
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
48QFN EP
Family Name
HCS08
Maximum Speed
40 MHz
Operating Supply Voltage
3.3|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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V
loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving equations 1 and 2 iteratively for any value of T
Freescale Semiconductor
D
DD
(at equilibrium) for a known T
I/O
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
is neglected) is:
T
θ
P
P
P
JA
A
D
int
I/O
1
2
3
4
= Ambient temperature, °C
Operating temperature range (packaged)
Thermal resistance
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
1s - Single Layer Board, one signal layer
2s2p - Four Layer Board, 2 signal and 2 power layers
int
DD
48-pin QFN
44-pin LQFP
32-pin LQFP
42-pin SDIP
+ P
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
1,2,3,4
K = P
int
Rating
A
and can be neglected. An approximate relationship between P
MC9S08AC16 Series Data Sheet, Rev. 8
. Using this value of K, the values of P
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
= T
J
A
) in °C can be obtained from:
+ 273°C) + θ
A
+ (P
SS
J
D
+ 273°C)
or V
× θ
Appendix A Electrical Characteristics and Timing Specifications
2s2p
2s2p
2s2p
2s2p
A
JA
DD
JA
.
1s
1s
1s
1s
)
× (P
will be very small.
Symbol
D
θ
T
)
JA
A
2
–40 to 125
T
Value
D
L
84
27
73
56
85
56
58
47
to T
and T
H
J
can be obtained by
°C/W
Unit
°C
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
and T
295
J
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