MCF51JM32VLH Freescale Semiconductor, MCF51JM32VLH Datasheet - Page 17

• Manufacturer Part Number: MCF51JM32VLH
• Description: MCU 32K FLASH 16K SRAM 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF51JMr

Specifications of MCF51JM32VLH

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I²C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LQFP
• Processor Series: MCF51JM
• Core: ColdFire V1
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 50.33 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 9
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: DEMOJM, DEMOFLEXISJMSD
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 12 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

The average chip-junction temperature (T
where:
For most applications, P
is:
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring P
for a known T
value of T
2.4
Although damage from static discharge is much less common on these devices than on early CMOS circuits, normal handling
precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices
can withstand exposure to reasonable levels of static without suffering any permanent damage.
All ESD testing is in conformity with CDF-AEC-Q00 Stress Test Qualification for Automotive Grade Integrated Circuits.
(http://www.aecouncil.com/) This device was qualified to AEC-Q100 Rev E.
A device is considered to have failed if, after exposure to ESD pulses, the device no longer meets the device specification
requirements. Complete DC parametric and functional testing is performed per the applicable device specification at room
temperature followed by hot temperature, unless specified otherwise in the device specification.
Freescale Semiconductor
A
Human Body
Latch-up
.
Electrostatic Discharge (ESD) Protection Characteristics
T
I
A
DD
A
3
4
. Using this value of K, the values of P
= Ambient temperature, °Cθ
1s - Single Layer Board, one signal layer
2s2p - Four Layer Board, 2 signal and 2 power layers
× V
Model
DD
I/O
, Watts — chip internal powerP
<< P
int
and can be neglected. An approximate relationship between P
Series Resistance
Storage Capacitance
Number of Pulse per pin
Minimum input voltage limit
Maximum input voltage limit
Table 8. ESD and Latch-up Test Conditions
MCF51JM128 ColdFire Microcontroller, Rev. 3
K = P
J
) in °C can be obtained from:
D
JA
P
T
= Package thermal resistance, junction-to-ambient, °C/WP
× (T
D
J
= K ÷ (T
= T
A
D
+ 273°C) + θ
A
Description
and T
I/O
+ (P
= Power dissipation on input and output pins — user determined
J
J
+ 273°C)
D
can be obtained by solving equations 1 and 2 iteratively for any
× θ
JA
JA
)
× (P
D
)
2
Preliminary Electrical Characteristics
Symbol
R1
—
—
—
C
D
and T
Value
1500
–2.5
100
7.5
3
J
(if P
D
D
= P
Unit
I/O
(at equilibrium)
pF
Ω
V
V
int
is neglected)
+ P
I/O
Eqn. 1
Eqn. 2
Eqn. 3
P
int
17
=