MCF51JM32VLH Freescale Semiconductor, MCF51JM32VLH Datasheet - Page 34

• Manufacturer Part Number: MCF51JM32VLH
• Description: MCU 32K FLASH 16K SRAM 64-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCF51JMr

Specifications of MCF51JM32VLH

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I²C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-LQFP
• Processor Series: MCF51JM
• Core: ColdFire V1
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 50.33 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 9
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: DEMOJM, DEMOFLEXISJMSD
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 12 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Preliminary Electrical Characteristics
2.13
This section provides details about program/erase times and program-erase endurance for the Flash memory.
Program and erase operations do not require any special power sources other than the normal V
2.14
The USB electricals for the USBOTG module conform to the standards documented by the Universal Serial Bus Implementers
Forum. For the most up-to-date standards, visit http://www.usb.org.
If the Freescale USBOTG implementation requires additional or deviant electrical characteristics, this space would be used to
communicate that information.
34
1
2
3
4
5
Num
Typical values are based on characterization data at V
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information
supplied for calculating approximate time to program and erase.
Typical endurance for Flash was evaluated for this product family on the 9S12Dx64. For additional information on
how Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin EB619/D, Typical
Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and
de-rated to 25°C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines
typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory.
10
1
2
4
6
8
3
5
7
9
Flash Specifications
USB Electricals
C
C
Supply voltage for program/erase
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Program/erase endurance
Data retention
T
T = 25°C
L
to T
H
= –40°C to + 105°C
Characteristic
5
3
(2)
MCF51JM128 ColdFire Microcontroller, Rev. 3
2
Table 21. Flash Characteristics
4
(2)
(2)
DD
V
= 5.0 V, 25°C unless otherwise stated.
Symbol
prog/erase
V
f
t
t
t
t
t
t
FCLK
Burst
Page
Mass
D_ret
Fcyc
prog
Read
10,000
Min
150
2.7
2.7
15
—
5
20,000
4000
100,000
Typ
9
4
100
—
DD
1
supply.
Freescale Semiconductor
Max
6.67
200
5.5
5.5
—
—
—
cycles
years
Unit
t
t
t
t
kHz
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V