MC9S08AC32MFDE Freescale Semiconductor, MC9S08AC32MFDE Datasheet - Page 22

• Manufacturer Part Number: MC9S08AC32MFDE
• Description: MCU 8BIT 32K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08AC32MFDE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 48-QFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Chapter 1 Introduction
Table 1
1.3
Some of the modules inside the MCU have clock source choices.
connection diagram. The ICG supplies the clock sources:
22
•
ICGOUT is an output of the ICG module. It is one of the following:
— The external crystal oscillator
lists the functional versions of the on-chip modules.
ICG
System Clock Distribution
ICGERCLK
FFE
ICGLCLK*
ICGOUT
CPU
Cyclic Redundancy Check Generator
Analog-to-Digital Converter
Internal Clock Generator
Inter-Integrated Circuit
Keyboard Interrupt
Serial Communications Interface
Serial Peripheral Interface
Timer Pulse-Width Modulator
Central Processing Unit
Debug Module
÷
CONTROL
SYSTEM
2
LOGIC
÷
Figure 1-2. System Clock Distribution Diagram
2
Table 1. Versions of On-Chip Modules
XCLK**
MC9S08AC60 Series Data Sheet, Rev. 2
1 kHz
RTI
COP
BUSCLK
* ICGLCLK is the alternate BDC clock source for the MC9S08AC60 Series.
** Fixed frequency clock.
Module
BDC
TPM1
TPM1CLK
TPM2CLK
TPM2
(CRC)
(DBG)
(ADC)
(TPM)
(CPU)
(ICG)
(SCI)
(KBI)
(SPI)
(IIC)
TPM3
Figure 1-2
TPMCLK
Version
IIC1
ADC1
1
1
4
2
1
4
3
3
2
2
shows a simplified clock
SCI1
Freescale Semiconductor
RAM
SCI2
CRC
FLASH
SPI1