MC9S08QE64CFT Freescale Semiconductor, MC9S08QE64CFT Datasheet - Page 13

• Manufacturer Part Number: MC9S08QE64CFT
• Description: IC MCU 8BIT 64K FLASH 48-QFN
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QE64CFT

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 50MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-QFN
• Processor Series: S08QE
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 50.33 MHz
• Number Of Programmable I/os: 38
• Number Of Timers: 3
• Operating Supply Voltage: - 0.3 V to + 3.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMOQE128, EVBQE128
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 12-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.4
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take P
the difference between actual pin voltage and V
unusually high pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
Freescale Semiconductor
T
θ
P
P
P
JA
A
D
int
I/O
Thermal Characteristics
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
3
int
DD
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
I
out of regulation. Ensure external V
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
DD
+ P
× V
, the injection current may flow out of V
I/O
DD
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
, Watts — chip internal power
Single-layer board
Four-layer board
32-pin LQFP
44-pin LQFP
48-pin QFN
64-pin LQFP
80-pin LQFP
32-pin LQFP
44-pin LQFP
48-pin QFN
64-pin LQFP
80-pin LQFP
MC9S08QE128 Series Data Sheet, Rev. 7
J
) in °C can be obtained from:
Rating
Table 5. Thermal Characteristics
SS
T
J
or V
= T
DD
A
DD
load will shunt current greater than maximum injection
+ (P
and multiply by the pin current for each I/O pin. Except in cases of
DD
D
and could result in external power supply going
× θ
JA
)
Symbol
T
θ
θ
θ
θ
T
JM
JA
JA
JA
JA
DD
A
range during instantaneous and
I/O
into account in power calculations, determine
–40 to 85
SS
Value
95
82
68
81
69
60
54
46
26
50
47
or V
In
> V
DD
DD
will be very small.
) is greater than
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
Electrical Characteristics
Eqn. 1
13