MC9S08DZ48AMLF Freescale Semiconductor, MC9S08DZ48AMLF Datasheet - Page 17
![MCU 8BIT 48K FLASH EE 48-LQFP](/photos/37/62/376254/lqfp-48_sml.jpg)
MC9S08DZ48AMLF
Manufacturer Part Number
MC9S08DZ48AMLF
Description
MCU 8BIT 48K FLASH EE 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets
1.DEMO9S08DZ60.pdf
(416 pages)
2.EVB9S08DZ60.pdf
(4 pages)
3.MC9S08DZ48AMLF.pdf
(458 pages)
Specifications of MC9S08DZ48AMLF
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
48KB (48K x 8)
Program Memory Type
FLASH
Eeprom Size
1.5K x 8
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S08DZ
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
3 KB
Interface Type
CAN, I2C, SCI, SPI
Number Of Programmable I/os
40
Number Of Timers
2
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DZ48AMLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Section Number
16.1 Introduction ....................................................................................................................................319
16.2 Signal Description ..........................................................................................................................324
16.3 Register Definition .........................................................................................................................328
16.4 Functional Description ...................................................................................................................334
16.5 Reset Overview ..............................................................................................................................340
16.6 Interrupts ........................................................................................................................................340
16.7 The Differences from TPM v2 to TPM v3.....................................................................................342
17.1 Introduction ....................................................................................................................................347
17.2 Background Debug Controller (BDC) ...........................................................................................348
17.3 On-Chip Debug System (DBG) .....................................................................................................357
Freescale Semiconductor
16.1.1 Features ...........................................................................................................................321
16.1.2 Modes of Operation ........................................................................................................321
16.1.3 Block Diagram ................................................................................................................322
16.2.1 Detailed Signal Descriptions ...........................................................................................324
16.3.1 TPM Status and Control Register (TPMxSC) ................................................................328
16.3.2 TPM-Counter Registers (TPMxCNTH:TPMxCNTL) ....................................................329
16.3.3 TPM Counter Modulo Registers (TPMxMODH:TPMxMODL) ....................................330
16.3.4 TPM Channel n Status and Control Register (TPMxCnSC) ..........................................331
16.3.5 TPM Channel Value Registers (TPMxCnVH:TPMxCnVL) ..........................................333
16.4.1 Counter ............................................................................................................................335
16.4.2 Channel Mode Selection .................................................................................................337
16.5.1 General ............................................................................................................................340
16.5.2 Description of Reset Operation .......................................................................................340
16.6.1 General ............................................................................................................................340
16.6.2 Description of Interrupt Operation ..................................................................................341
17.1.1 Forcing Active Background ............................................................................................347
17.1.2 Features ...........................................................................................................................348
17.2.1 BKGD Pin Description ...................................................................................................349
17.2.2 Communication Details ..................................................................................................350
17.2.3 BDC Commands .............................................................................................................354
17.2.4 BDC Hardware Breakpoint .............................................................................................356
17.3.1 Comparators A and B ......................................................................................................357
17.3.2 Bus Capture Information and FIFO Operation ...............................................................357
17.3.3 Change-of-Flow Information ..........................................................................................358
17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................358
17.3.5 Trigger Modes .................................................................................................................359
17.3.6 Hardware Breakpoints ....................................................................................................361
Timer Pulse-Width Modulator (S08TPMV3)
MC9S08DZ60 Series Data Sheet, Rev. 4
Development Support
Chapter 16
Chapter 17
Title
Page
17
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