MC9S08DZ48AMLH Freescale Semiconductor, MC9S08DZ48AMLH Datasheet - Page 372
![IC MCU 48K FLASH 3K RAM 64-LQFP](/photos/12/35/123568/mc9s08dz48amlh_sml.jpg)
MC9S08DZ48AMLH
Manufacturer Part Number
MC9S08DZ48AMLH
Description
IC MCU 48K FLASH 3K RAM 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheets
1.DEMO9S08DZ60.pdf
(416 pages)
2.EVB9S08DZ60.pdf
(4 pages)
3.MC9S08DZ48AMLF.pdf
(458 pages)
Specifications of MC9S08DZ48AMLH
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
48KB (48K x 8)
Program Memory Type
FLASH
Eeprom Size
1.5K x 8
Ram Size
3K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 24x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LQFP
Processor Series
S08DZ
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
3 KB
Interface Type
CAN, I2C, SCI, SPI
Number Of Programmable I/os
53
Number Of Timers
2
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 24 Channel
Controller Family/series
HCS08
No. Of I/o's
53
Eeprom Memory Size
1.5KB
Ram Memory Size
3KB
Cpu Speed
40MHz
No. Of Timers
2
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
For Use With
EVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DZ48AMLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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Appendix A Electrical Characteristics
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving equations 1 and 2 iteratively for any value of T
A.5
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM) and the Charge Device Model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
372
D
(at equilibrium) for a known T
Num
Human Body
Latch-up
1
2
3
ESD Protection and Latch-Up Immunity
Model
Human Body Model (HBM)
Charge Device Model (CDM)
Latch-up Current at T
Series Resistance
Storage Capacitance
Number of Pulse per pin
Minimum input voltage limit
Maximum input voltage limit
Table A-5. ESD and Latch-Up Protection Characteristics
Table A-4. ESD and Latch-up Test Conditions
A
= 125°C
Rating
A
. Using this value of K, the values of P
MC9S08DZ60 Series Data Sheet, Rev. 4
Description
A
.
Symbol
V
V
I
HBM
CDM
LAT
Symbol
+/- 2000
+/- 500
+/- 100
R1
C
–
Min
D
and T
J
Value
1500
–2.5
100
can be obtained by
7.5
Max
3
Freescale Semiconductor
–
–
–
Unit
pF
Ω
Unit
mA
V
V
V
V
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