MC56F8346VFVER2 Freescale Semiconductor, MC56F8346VFVER2 Datasheet - Page 166
MC56F8346VFVER2
Manufacturer Part Number
MC56F8346VFVER2
Description
IC HYBRID CTRLR 16BIT 144-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheet
1.MC56F8346VFVE.pdf
(178 pages)
Specifications of MC56F8346VFVER2
Core Processor
56800
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
62
Program Memory Size
136KB (68K x 16)
Program Memory Type
FLASH
Ram Size
6K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
For Use With
MC56F8367EVME - EVAL BOARD FOR MC56F83X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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•
Cload is expressed in pF
Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found
to be fairly low when averaged over a period of time. The one possible exception to this is if the chip is
using the external address and data buses at a rate approaching the maximum system rate. In this case,
power from these buses can be significant.
E, the external [static component], reflects the effects of placing resistive loads on the outputs of the
2
device. Sum the total of all V
/R or IV to arrive at the resistive load contribution to power. Assume V =
0.5 for the purposes of these rough calculations. For instance, if there is a total of 8 PWM outputs driving
10mA into LEDs, then P = 8*.5*.01 = 40mW.
In previous discussions, power consumption due to parasitics associated with pure input pins is ignored,
as it is assumed to be negligible.
56F8346 Technical Data, Rev. 15
166
Freescale Semiconductor
Preliminary
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