MC56F8322VFAE Freescale Semiconductor, MC56F8322VFAE Datasheet - Page 124

• Manufacturer Part Number: MC56F8322VFAE
• Description: IC DSP 16BIT 60MHZ 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8322VFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 21
• Program Memory Size: 40KB (20K x 16)
• Program Memory Type: FLASH
• Ram Size: 6K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 48-LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 40 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Interface Type: SCI, SPI, CAN
• Minimum Operating Temperature: - 40 C
• For Use With: MC56F8323EVME - BOARD EVALUATION MC56F8323
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

10.16 Equivalent Circuit for ADC Inputs
Figure 10-21
at the same time that S3 is closed/open. When S1/S2 closed & S3 open, one input of the sample and hold
circuit moves to (V
switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended
analog input is switched to a differential voltage centered about (V
on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there
are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into
the S/H output voltage, as S1 provides isolation during the charge-sharing phase.
One aspect of this circuit is that there is an on-going input current, which is a function of the analog input
voltage, V
10.17 Power Consumption
See
which can be used to optimize power consumption for a given application.
Power consumption is given by the following equation:
A, the internal [static component], is comprised of the DC bias currents for the oscillator, leakage currents,
PLL, and voltage references. These sources operate independently of processor state or operating
frequency.
B, the internal [state-dependent component], reflects the supply current required by certain on-chip
resources only when those resources are in use. These include RAM, Flash memory and the ADCs.
124
Total power =
1.
2.
3.
4.
Section 10.1
Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pf
Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pf
Equivalent resistance for the ESD isolation resistor and the channel select mux; 500 ohms
Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only
connected to it at sampling time; 1pf
REF
illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed
Analog Input
and the ADC clock frequency.
+D: external [dynamic component]
for a list of IDD requirements for the device. This section provides additional detail
+B: internal [state-dependent component]
+C: internal [dynamic component]
+E: external [static]
A: internal [static component]
REFH
1
Figure 10-21 Equivalent Circuit for A/D Loading
-V
REFLO
2
)/2, while the other charges to the analog input voltage. When the
56F8322 Techncial Data, Rev. 16
(V
REFH
3
- V
REFLO )
/ 2
S1
S2
4
S3
REFH
C1
C2
S/H
-V
REFLO
C1 = C2 = 1pF
)/2. The switches switch
Freescale Semiconductor
Preliminary