HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 25
HD64F2218TF24
Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Specifications of HD64F2218TF24
Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a
subroutine call, and the PC, condition-code register (CCR), and extended control register (EXR)
are pushed onto the stack in exception handling, they are stored as shown in figure 1.5. When
EXR is invalid, it is not pushed onto the stack. For details, see the relevant hardware manual.
SP
Notes: 1.
(a) Subroutine Branch
2.
3.
When EXR is not used it is not stored on the stack.
SP when EXR is not used.
Ignored on return.
Reserved
(24 bits)
Figure 1.5 Stack Structure in Advanced Mode
PC
(SP
SP
*2
Rev. 4.00 Feb 24, 2006 page 9 of 322
)
(b) Exception Handling
Reserved
(24 bits)
EXR
CCR
PC
*1
*1 *3
REJ09B0139-0400
Section 1 CPU
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