HD64F3687FPIV Renesas Electronics America, HD64F3687FPIV Datasheet - Page 384

MCU 3/5V 56K I-TEMP PB-FREE 64-L

HD64F3687FPIV

Manufacturer Part Number
HD64F3687FPIV
Description
MCU 3/5V 56K I-TEMP PB-FREE 64-L
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3687FPIV

Core Processor
H8/300H
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI
Peripherals
PWM, WDT
Number Of I /o
45
Program Memory Size
56KB (56K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3687FPIV
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Section 19 EEPROM
Rev.5.00 Nov. 02, 2005 Page 350 of 500
REJ09B0027-0500
SDA
SCL
[Legend]
ESAR: Register for referring the slave address
(specifies the slave address of the memory array)
I
2
C bus interface
control circuit
Figure 19.1 Block Diagram of EEPROM
Key control circuit
register (EKR)
EEPROM Key
ESAR
H'FF10
EEPROM Data bus
Power-on reset
Memory
array
EEPROM module
Slave address
Booster circuit
Sense amp.
(512 bytes)
User area
Y-select/
register
H'0000
H'01FF
H'FF09

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