MCF5233CVM100J Freescale Semiconductor, MCF5233CVM100J Datasheet - Page 11

• Manufacturer Part Number: MCF5233CVM100J
• Description: IC MCU 64K SRAM 100MHZ 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF523xr

Specifications of MCF5233CVM100J

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 61
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Processor Series: MCF523x
• Core: ColdFire V2
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: NNDK-MOD5234-KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

5.2.1.2
If V
impedance state. There is no limit on how long after V
down. V
will be undesired high current in the ESD protection diodes. There are no requirements for the fall times
of the power supplies.
The recommended power down sequence is as follows:
5.3
5.4
5.5
5.6
Freescale Semiconductor
1. Drop V
2. Drop OV
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DD
Place the decoupling caps as close to the pins as possible, but they can be outside the footprint of
the package.
0.1 μF and 0.01 μF at each supply input
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See
Use external pull-up resistors on unused inputs. See pin table.
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop currents
in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
is powered down first, then sense circuits in the I/O pads cause all output drivers to be in a high
DD
Decoupling
Buffering
Pull-up Recommendations
Clocking Recommendations
should not lag OV
Power Down Sequence
DD
DD
to 0 V.
/V
DDPLL
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
supplies.
DD
or V
DDPLL
going low by more than 0.4 V during power down or there
Section 7, “Electrical
DD
powers down before OV
Characteristics.”
DD
Design Recommendations
/V
DDPLL
must power
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