MCF5234CVM150J Freescale Semiconductor, MCF5234CVM150J Datasheet - Page 20
MCF5234CVM150J
Manufacturer Part Number
MCF5234CVM150J
Description
IC MCU 64K 150MHZ 256MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF523xr
Datasheet
1.MCF5232CVM100J.pdf
(48 pages)
Specifications of MCF5234CVM150J
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
97
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
256-MAPBGA
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
150MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Supply Voltage (max)
1.6/3.6V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
MA-BGA
Processor Series
MCF523x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5234-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF5234CVM150J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Mechanicals/Pinouts and Part Numbers
6.2.2
Figure 7
20
15X
e
Y
E
shows MCF5235CVMxxx, MCF5234CVMxxx, and MCF5233CVMxx package dimensions.
S
X
Package Dimensions—256 MAPBGA
0.20
16
15
14
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
13
12
11
VIEW M-M
10
MCF523x Integrated Microprocessor Hardware Specification, Rev. 4
D
7
6
5
15X
S
4
3
e
2
1
Figure 7. 256 MAPBGA Package Outline
G
M
A
B
C
D
E
F
H
J
K
L
N
P
R
T
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
K
256X
M
M
0.25
0.10
b
3
M
M
Z
Z
X
Y
A
A2
A1
Z
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
4
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
DETAIL K
DIM
A1
A2
A
D
E
S
b
e
°
MILLIMETERS
MIN
1.25
0.27
0.40
256X
17.00 BSC
17.00 BSC
1.16 REF
1.00 BSC
0.50 BSC
0.15
MAX
1.60
0.47
0.60
Freescale Semiconductor
Z
0.30
5
Z