MAXQ610A-0000+ Maxim Integrated Products, MAXQ610A-0000+ Datasheet - Page 8

• Manufacturer Part Number: MAXQ610A-0000+
• Description: IC MCU 16BIT 64K IR MOD 32TQFN
• Manufacturer: Maxim Integrated Products
• Series: MAXQ™r

Specifications of MAXQ610A-0000+

• Core Processor: RISC
• Core Size: 16-Bit
• Speed: 12MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
• Number Of I /o: 20
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.7 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 32-TQFN Exposed Pad
• Processor Series: MAXQ610
• Core: RISC
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: SPI, USART
• Maximum Clock Frequency: 12 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 1.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Controller Family/series: MAXQ
• No. Of I/o's: 24
• Ram Memory Size: 2048Byte
• Cpu Speed: 12MHz
• No. Of Timers: 2
• Embedded Interface Type: JTAG, SPI, USART
• Rohs Compliant: Yes
• Number Of Programmable I/os: 32
• Development Tools By Supplier: MAXQ610-KIT
• Package: 32TQFN EP
• Family Name: MAXQ
• Maximum Speed: 12 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 90-M6800+B01

16-Bit Microcontroller with Infrared Module
8
13, 22, 30
32 TQFN
15, 29
_______________________________________________________________________________________
14
28
18
19
31
32
—
40 TQFN
18, 38
PIN
17
37
21
22
39
40
—
—
44 TQFN
17, 20,
19, 41
28, 42
18
40
23
24
43
44
—
REGOUT
HFXOUT
NAME
RESET
HFXIN
GND
IRTX
IRRX
V
EP
DD
Supply Voltage
Ground. These pins must be directly connected to the ground plane. The 40-pin
TQFN package does not have any ground pins and connects to ground through
the exposed pad.
Regulator Capacitor. This pin must be connected to ground through a 1.0μF
external ceramic-chip capacitor. The capacitor must be placed as close to this
pin as
this pin.
Exposed Pad. For the 32-pin TQFN package, leave unconnected.
For the 40-pin TQFN package, the exposed pad is internally connected to GND.
Connect to the ground plane.
For the 44-pin TQFN package, the EP has no internal connection to the device.
Leave unconnected. Not intended as an electrical connection point.
Digital, Active-Low, Reset Input/Output. The CPU is held in reset when this pin
is low and begins executing from the reset vector when released. The pin
includes pullup current source and should be driven by an open-drain, external
source capable of sinking in excess of 4mA. This pin is driven low as an output
when an internal reset condition occurs.
High-Frequency Crystal Input. Connect external crystal or resonator between
HFXIN and HFXOUT as the high-frequency system clock. Alternatively, HFXIN is
the input for an external, high-frequency clock source when HFXOUT is
unconnected.
IR Transmit Output. IR transmit pin capable of sinking 25mA. This pin defaults
to high-impedance input with the weak pullup disabled during all forms of reset.
Software must configure this pin after release from reset to remove the high-
impedance input condition.
IR Receive Input. IR receive pin. This pin defaults to high-impedance input with
the weak pullup disabled during all forms of reset. Software must configure this
pin after release from reset to remove the high-impedance input condition.
possible.
No devices other than the capacitor should be connected to
IR FUNCTION PINS
POWER PINS
RESET PINS
CLOCK PINS
FUNCTION
Pin Description